Layout and Assembling recommendation for AR6000

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Layout and Assembling recommendation for AR6000

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Layout and Assembling recommendation for AR6000

1. Add 1.5µF or 2.2µF ​100V capacitor between B+A and GND. Better performance of X7R capacitor.

2. connect backside of die to AGND.

both of these two recommendations are for EMC concern.​

If die has no back metal. we recommend customer use epoxy technology (silver glue), and also connect backside to GND​.

For epoxy technology (silver glue 银浆工艺), please refer to attachment.

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Last update:
‎08-30-2021 11:42 PM
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