1. Add 1.5µF or 2.2µF 100V capacitor between B+A and GND. Better performance of X7R capacitor.
2. connect backside of die to AGND.
both of these two recommendations are for EMC concern.
If die has no back metal. we recommend customer use epoxy technology (silver glue), and also connect backside to GND.
For epoxy technology (silver glue 银浆工艺)， please refer to attachment.
