Gel Remove for Die Sales

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Gel Remove for Die Sales

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Gel Remove for Die Sales

For die sales products, we only accept CQC that already no gel above the die.

Because:

Before starting FA, we need to remove the die from brush holder or PCB. And then rebond into a special package. If gel is not removed, the die cannot be rebond. Please make sure the die is totally gel removed. Otherwise, FA cannot do wire bond.

Gel remove recipe:

Can be: MOMENTIVE Silopren* Silicone Remover TP 3888

https://www.momentive.com/products/showtechnicaldatasheet.aspx?id=10807

DOE parameters:

  • Soak time: 1-24h
  • Temperature (60°)
  • Chemical Product refresh (3cycle)
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Revision #:
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Last update:
‎08-30-2021 11:33 PM
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