Gel Remove for Die Sales

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Gel Remove for Die Sales

Gel Remove for Die Sales

For die sales products, we only accept CQC that already no gel above the die.


Before starting FA, we need to remove the die from brush holder or PCB. And then rebond into a special package. If gel is not removed, the die cannot be rebond. Please make sure the die is totally gel removed. Otherwise, FA cannot do wire bond.

Gel remove recipe:

Can be: MOMENTIVE Silopren* Silicone Remover TP 3888

DOE parameters:

  • Soak time: 1-24h
  • Temperature (60°)
  • Chemical Product refresh (3cycle)
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Version history
Last update:
‎08-30-2021 11:33 PM
Updated by: