There are two thermal diodes located at different locations on the die. One that is close to core clusters and the other one is more close to platform logic, thus each diodes has two pins the cathode and the anode, you need to use the cathode and anode to measure temperature for each site/diode. Some times there are difference in temperature between different sites on die, the difference can be large, up to 20C in extreme cases and thus it is wise to do measurement on both available sites.
Have a great day,
Alexander
TIC
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