My customer is using mpc870cvr133, there are more than 20 pieces of bad after soldering. The engineer analysis may be caused by the chip soldering problem. Can we provide a soldering temperature guide to see if the soldering temperature of the customer is too high and the chip is damaged?
Soldering temperature profile depends of solder paste and should be suggested by your solder paste vendor.
For NXP recommended soldering profile please look this document, page 20:
https://www.nxp.com/docs/en/package-information/PBGAPRES.pdf
Have a great day,
Alexander
TIC
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