We would like to add heat sink on LS1046A and this heat sink will be connected to chassis. We would like to maintain Isolation between the chassis and LS1046S GND pins.
So I would like to know LS1046A metal case is connected to GND pins or not. If not connected, how much isolation is between GND pins and LS 1046A metal case.
The lid is connected to the back of the die with thermal interface material and the foot of the lid attached down to substrate with epoxy. No tie in to ground
Nevertheless it is needed to use thermal interface material between heatsink and the lid - refer to the QorIQ LS1046A, LS1026A Data Sheet, Figure 91. Package exploded, cross-sectional view-FC-PBGA.