Hello,
Would anyone happen to know the Junction-to-Case thermal resistance for the 2.5 GHz Low Power Amplifier Module (P/N: AFLP5G25641)? It is not available on the datasheet.
Thanks,
D Patel
Solved! Go to Solution.
Hello D_Patel,
I am pleased to contact you again.
The AFLP5G25641 has 3 stages of amplification (as shown on fig1 of the data sheet).
The qjc of the 3d stage, the hottest one, is 63°C/W.
To clarify, what we refer as case is the bottom of the package, not the top.
I hope this information helps.
Regards,
David
Hello D_Patel,
I hope all is great with you. Thank you for using the NXP communities.
The available thermal information of the device is shown below:
I hope this information helps.
Regards,
David
Hi David,
Thanks for the reply. Unfortunately, I do not see the Junction-to-Case resistance in your screenshot, nor do I see a way to calculate or estimate with the information provided. I imagine there is no additional thermal information available for AFLP5G25641? Any thermal test data?
Thanks,
Deven Patel
Hello D_Patel,
I am pleased to contact you again.
The AFLP5G25641 has 3 stages of amplification (as shown on fig1 of the data sheet).
The qjc of the 3d stage, the hottest one, is 63°C/W.
To clarify, what we refer as case is the bottom of the package, not the top.
I hope this information helps.
Regards,
David