UAES did thermal simulation for S32G, they found it cannot pass thermal simulation based on their Mechanical thermal design. Currently, customer use thermal paste only. The chip worst case power consumption is 4.67 W and normal case is 3.1 W. Both failed.
Detailed customer mechanical info and simulation result attached.
Two questions from customer for NXP:
1. Whether S32G can work without adding fans inside ECU box based on current power consumption?
2. Any suggestion from NXP side for current customer thermal design ?