It does not seem to be any of our reference designs so we can not ensure its performance of it, in this case, please ask the designer so he can give you some advice, for my part I recommend you to do the following:
Mount the reference circuit onto a heatsink capable of dissipating more than 600 W in order to provide enough thermal dissipation (the baseplate included in this reference circuit is not sufficient to serve as a standalone heatsink).
Connect the ground.
Terminate the RF output with a 50 ohm load capable of dissipating more than 700 W.
Connect the RF input to a 50 ohm source with the RF off.
Connect the drain voltage (V DD ) and raise it slowly to 50 V while ensuring that the drain current remains below or equal to the typical drain quiescent current of I DQ(A+B) B)= 150 mA.
If needed, adjust the R3 potentiometer to modify the gate voltage to adjust the drain quiescent current.
Raise the RF input slowly to 13.3 W (41.2 dBm).
Check the RF output power (typically 700 W), the drain current (around 25 A for this power level) and the temperature of the board.
