Using Accelerometers, Magnetometers, Gyroscopes, gathering Sensor data can be tricky and not straight-forward. In this class, we will go into a Sensor Deep-Dive, where each sensor will be visualized and explained in detail. When collecting data there are several things that can make collecting the data easier, more efficient, and avoiding erroneous data all together. We will have several demonstrations and examples to show the pitfalls and successes of collecting data.
The innovative LPC portfolio of MCUs, based on ARM® Cortex®-M cores, continues to expand to support next-generation performance, power, security and connectivity needs for many applications. This session will provide an overview of the LPC MCU portfolio, focusing on the latest products and enablement available today. Attendees will gain a better understanding of how to find the right solution to get started with an LPC-based design.
Ultra Wide Band (UWB) is just about to enter the automotive space. UWB in automotive NXP enables new convenience and functional safety use cases and an increased level of security. In this session we will discuss UWB - RF technology used in the automotive domain, specifically for secure car access systems. We provide an overview of customer needs and explain advanced features and the potential of this brand new NXP solution. Watch Video Presentation
Providing power for the latest processors used in ADAS systems combines best practices from both the automotive and networking disciplines. Linear Technology’s deep knowledge in both fields and years of supporting applications for automotive and networking systems, including new standards such Power Over Data Line (PoDL) will ensure a robust power supply network for your applications. In this session Dave Dwelley, Office the CTO at Linear Technology, will discuss a roadmap to success as the data center on wheels becomes a reality.
The Influencers Summit brings some of the smartest and most influential people together to openly share, debate, and learn from one another. The session provides a panel discussion with experts, followed by an opportunity for attendees to participate in roundtable discussions with IoT Security influencers. Topics that will be covered include: What plans are in place for regulating IoT activity? What needs to be done to ensure Security and Privacy concerns do not hinder future developments and deployments of IoT? How do attackers compromise connected devices? What will it take for the technology and business to make it a success? How will we know when we are there?
This session will provide customers the opportunity to meet with a variety of LPC engineers and marketers to discuss critical topics for today's embedded applications, such as security, connectivity, power consumption, and time-to-market. Attendees will have the opportunity to discuss the latest LPC roadmap, ask technical questions, and provide direct feedback to the LPC leadership team.
The Internet of Tomorrow surrounds us with electronic solutions connected to the cloud. We must be confident they operate safely, securely and with the highest quality and reliability. The autonomous vehicle is the ultimate connected device. This session will highlight 66 critical differences that may exist between automotive and consumer components as identified by an industry expert workgroup that impact reliability, quality and the lifetime of vehicles. This overview of potential differences across markets might be the ideal tool to guide customers in their component selection. NXP is the leader in Automotive, security and connectivity as well as in highest-end computer Networking. We will demonstrate how NXP’s capabilities across product segments and performance ranges addresses many of your hidden risks and providing an excellent starting point towards your connected solutions. Watch Video Presentation
Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required. Watch Video Presentation
The NXP supply chain team will present an overview of the new NXP global manufacturing footprint, as well as integrated strategies for supply assurance and crisis management. An overview of current supply chain systems integration activities will be discussed as well as customer order management strategies moving forward. A special focus will be placed on highlighting changes that will affect NXP customers. Watch Video Presentation
This session discusses how the i.MX applications processors interface with the new NXP portfolio. We will review the i.MX processor family and how they can be connected to NXP components to create complete automotive platforms. Watch Video Presentation
Plasma cleaning has been used extensively in the IC packaging industry for cleaning assembly materials to improve its cleanliness for the subsequent process, and enhance the overall package or device reliability. One of the challenges is how to establish the compatibility of the cleaning process as various materials are exposed to the plasma. The control of contamination is very important with the recent use of Cu wires in IC packaging. Bond pad corrosion has been found to be critical in device and package reliability and this is one of the main issues that will be tackled in this paper. Evaluation results that include surface analysis and reliability testing using the different plasma cleaning configurations and its other applications will be presented.
As the Smart Home starts to gather momentum, a number of competing Wireless Communication standards are fighting for dominance. With ZigBee® now becoming dominant in the low-power networking market, there is no surprise that two new low power technology Thread and Bluetooth® Low Energy with the new Mesh capability are both trying to enter this market to get a piece of the cake. Moreover competing IoT platforms from the Thread Group (Google/Nest), Allseen Alliance (Qualcomm), Apple's Homekit, the Open Interconnect Consortium (Intel) and many others are creating even more confusion. So in this confusing array of Wireless Communication standards and Iot platforms, what are the main features of each and what does it means for NXP? This session will provide an overview of these Wireless connectivity standards and IoT platforms, their capabilities, and their implication for NXP IoT. Watch Video Presentation
Smart digitalized packaging as a subset of the Internet of Things - a huge trend impacting global packaging industry today. NXP is the Identification industry's #1 chip supplier for smart secure NFC-RFID technology offering a variety of tag ICs from short to long-range, allowing interaction with mobile phones connecting products to the cloud and customers to brands. Watch Video Presentation
NXP is one of the pioneers in bringing helping bring multicore solutions to the aviation industry and helping customers navigate the certification requirements. This session will cover the roadmap and status of current certification activities, challenges for 2016 we are addressing for both PPC and ARM devices.
The mil/aero industry is experiencing an increasing demand for COTS DO-254 safety critical solutions. Trends such as the digitization of cockpits, commercial technology complexity, and the use of common avionics subsystems in military and commercial aircraft have solidified the need for DO-254 compliance in military platforms. DO-254 certification was traditionally achieved using costly custom built systems; however, cost-effective COTS modules are now becoming the hardware of choice to reduce the applicant’s risk, time to market, and budget concerns while meeting stringent certification requirements. We will discuss the benefits and concerns of implementing COTS modules for DO-254 certification.
Countless devices are joining the Internet of Things (IoT) daily. It is a key requirement that the device architecture of the device itself is secure; above and beyond the mandatory connection privacy. Embedded devices also require a device security approach that can follow future security trends, changes, and threats throughout their entire product lifecycle. This session looks at reported cases of device vulnerability in the industry, available technology, and best practices for designing secure connected products. Based and built on the Digi ConnectCore for i.MX6UL connected SOM platform, and without the traditional burden of effort related to design and implementation.
Today’s designers are facing ever increasing challenges to protect their intellectual property and products from counterfeiting or unauthorized access. To help customers better understand the solutions offered by NXP, Future’s System Design Center has designed a Secure Access Demo board to showcase the capabilities of the LPC43S57, a microcontroller with integrated security, and the A700X, a tamper resistant secure MCU solution. This class will present an overview of the architecture of a secured system and provide an introduction to the secured elements from NXP. Watch Video Presentation
The first step to creating a smart sensor algorithm is collecting sensor data for analyses. This session will present a series of sensor data logging options which allow engineers to create dataloggers quickly using Kinetis SDK framework by including IS-SDK without having to concerning themselves with any mudance sensor integration efforts. Watch Video Presentation
A modern car is more than just transport, it provides comfortable heating and cooling, navigation systems, entertainment systems, and a lot of data about the car's health and performance. Including how well you are conserving fuel or when to seek service. All of this is a challenge to present to the driver and passengers, without distraction to driving, under all conditions from bright daylight to the dark of night, in any temperature. We talk about both Liquid Crystal Display (LCD) and Light Emitting Diode (LED) component solutions that keep your dashboard simple, readable, and helpful. Watch Video Presentation
In this session, a panel of multi-disciplinary experts will describe and discuss the challenges of securing the connected world around us. The session will cover three major facets of creating secure solutions, addressing the challenges and emerging trends for: *Device Security - Securing edge nodes, smart cards, certifications *Network Security - Secure data transmission, security protocols *Internet of Things Security -Trust, crypto, tamper Subject matter experts will present an overview of each of these topics, followed by an interactive dialogue with the audience. It is hoped that the audience will gain a high-level understanding of the multi-faceted challenges of securing end to end solutions, and how semiconductor companies will work with ecosystem partners, innovators, and policy makers to address those challenges.