NXP FTF 2016 - Training Presentations

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NXP FTF 2016 - Training Presentations

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The NXP supply chain team will present an overview of the new NXP global manufacturing footprint, as well as integrated strategies for supply assurance and crisis management. An overview of current supply chain systems integration activities will be discussed as well as customer order management strategies moving forward. A special focus will be placed on highlighting changes that will affect NXP customers. Watch Video Presentation
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Saving Space in your Reference Design with eSIM. eSIM (eUICC) and what it means for chipset makers and device OEMs. Today consumers want bigger screens, more battery life, more storage, more rich media content etc. The (R) evolution that eSIM will create is unique, disruptive and can be compared to the time when black and white TV went to Color. The OEMs are adopting slowly, but like the days of B&W TV, the networks weren’t ready, and neither are the Mobile operators in the case of eSIM!
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This presentation introduces the IoT Sensing SDK (ISSDK) and the Sensor Toolbox evaluation platforms. The presentation will show how engineers can use ISSDK and Sensor Toolbox to collect and visualize sensor data out of the box.
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The Internet of Tomorrow surrounds us with electronic solutions connected to the cloud. We must be confident they operate safely, securely and with the highest quality and reliability. The autonomous vehicle is the ultimate connected device. This session will highlight 66 critical differences that may exist between automotive and consumer components as identified by an industry expert workgroup that impact reliability, quality and the lifetime of vehicles. This overview of potential differences across markets might be the ideal tool to guide customers in their component selection. NXP is the leader in Automotive, security and connectivity as well as in highest-end computer Networking. We will demonstrate how NXP’s capabilities across product segments and performance ranges addresses many of your hidden risks and providing an excellent starting point towards your connected solutions. Watch Video Presentation
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LEDs are being used increasingly in automotive lighting applications to enable creative design elements, improve system efficiency and support advanced driver assistance systems (ADAS). NXP is developing a Matrix LED controller (MLC) IC so customers can address these advanced lighting applications. The MLC IC provides all the necessary functionality to ensure a compact, low-cost and robust design for advanced LED headlights. This new technology enables a three dimensional high-resolution control of the output of a headlight. In this session learn about the key trends and requirements for advanced LED headlighting and understand how the functionality of our MLC addresses these requirements. See the demo for your self!
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This session discusses how the i.MX applications processors interface with the new NXP portfolio. We will review the i.MX processor family and how they can be connected to NXP components to create complete automotive platforms. Watch Video Presentation
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The mil/aero industry is experiencing an increasing demand for COTS DO-254 safety critical solutions. Trends such as the digitization of cockpits, commercial technology complexity, and the use of common avionics subsystems in military and commercial aircraft have solidified the need for DO-254 compliance in military platforms. DO-254 certification was traditionally achieved using costly custom built systems; however, cost-effective COTS modules are now becoming the hardware of choice to reduce the applicant’s risk, time to market, and budget concerns while meeting stringent certification requirements. We will discuss the benefits and concerns of implementing COTS modules for DO-254 certification.
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Plasma cleaning has been used extensively in the IC packaging industry for cleaning assembly materials to improve its cleanliness for the subsequent process, and enhance the overall package or device reliability. One of the challenges is how to establish the compatibility of the cleaning process as various materials are exposed to the plasma. The control of contamination is very important with the recent use of Cu wires in IC packaging. Bond pad corrosion has been found to be critical in device and package reliability and this is one of the main issues that will be tackled in this paper. Evaluation results that include surface analysis and reliability testing using the different plasma cleaning configurations and its other applications will be presented.
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