Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.
Please advise at Page 63 regarding the Assembly Package Process Flow, the arrows at the second row indicating the process flow are reserved. Should it be: Plasma Clean --> Wire Bonding --> Mold --> Post Mold Cure .......