INS-N2024 Semiconductor 101-102 Functionality and Manufacturing of Integrated Circuits

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INS-N2024 Semiconductor 101-102 Functionality and Manufacturing of Integrated Circuits

INS-N2024 Semiconductor 101-102 Functionality and Manufacturing of Integrated Circuits

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

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Please advise at Page 63 regarding the Assembly Package Process Flow, the arrows at the second row indicating the process flow are reserved.  Should it be: Plasma Clean --> Wire Bonding --> Mold --> Post Mold Cure .......

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Last update:
‎05-25-2016 01:35 PM
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