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This doc explain how to modify the bootloader to boot linux&mcal, to solve the conflict between bootloader, mcal and linux   本文说明在S32G2 RDB2板上如何定制开发Bootloader,本文示例主要实现功能是: Bootloader启动一个M核,MCAL驱动测试程序,本文分别测试了MCU,DIO,UART的MCAL驱动示例代码。 Bootloader同时启动A53 Linux 目录 1    需要的软件,工具,文档与说明... 3 1.1  软件与工具... 3 1.2  参考文档... 3 1.3  开发说明... 3 2    测试软件安装编译说明... 4 2.1  安装RTD_MCAL驱动... 4 2.2  编译MCAL驱动测试程序(以MCU为例) 5 2.3  优化重排M7 demo镜像及与MPU设置的配合... 5 2.4  去掉CLOCK INIT. 7 2.5  去掉MCU相关INIT. 8 2.6  DIO MCAL程序去掉PORT INIT. 9 2.7  UART MCAL程序去掉PORT INIT. 10 2.8  UART MCAL程序修改CLOCK TREE.. 10 2.9  解决中断冲突... 11 2.10 准备A53 Linux镜像... 12 3    Bootloader工程说明... 13 3.1  关掉XRDC支持... 13 3.2  关掉eMMC/SD支持(可选) 14 3.3  关掉secure boot(可选) 14 3.4  增加MCAL驱动所需要的PORT的初始化... 15 3.5  解决Bootloader,MCAL与Linux的clock冲突... 17 3.6  配置A53 Boot sources: 34 3.7  配置M7 Boot sources: 35 3.8  关闭调试软断点:... 36 3.9  编译Bootloader工程... 37 3.10 制造Bootloader的带IVT的镜像... 38 3.11 烧写镜像... 41 4    测试... 42 4.1  硬件连接... 42 4.2  MCU MCAL+Linux测试过程... 42 4.3  DIO MCAL+Linux测试过程... 43 4.4  UART MCAL+Linux测试过程... 43 5    Bootloader源代码说明... 43 6    Bootloader定制说明... 45 6.1  QSPI NOR驱动说明... 45 6.2  eMMC/SDcard启动支持... 46 6.3  DDR初始化... 46 6.4  Secure Boot支持... 46 7    调试说明... 46 7.1  Bootloader的调试... 46 7.2  MCAL驱动的调试... 46
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Demo Owner Rebeca   T he Freescale concept car demonstrates multiple solutions for automotive systems in powertrain, infotainment, cluster, safety and body applications. Specific system solutions include engine control, small and large motor control, lamp control, radio, digital cluster, gauge drivers, TPMS, touch control, surround view camera, media player and fast boot Linux®.     https://community.nxp.com/players.brightcove.net/4089003392001/default_default/index.html?videoId=4282635362001" style="color: #05afc3; background-color: #ffffff; font-size: 14.4px;" target="_blank   Featured NXP Products Qorivva S12 MagniV S08 i.MX6 Links Automotive
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Demo Owner Mike Stanley   Tire Pressure Monitoring Systems (TPMS) help drivers with precise direct tire pressure measurement by providing individual tire readings – including the spare. NXP's world’s smallest, lowest-power, with highest memory for customer use TPMS is highly integrated with a pressure sensor, temperature sensor, accelerometer, MCU and a transmitter. Watch Mike Stanley explain the pressure sensor readings, temperature sensor display and the accelerometer/motion readings. These readings are time based periodic measurements where the data is given as an output to the driver.   Features Simulation that portraits the TPMS as if it were inside the vehicles tires and sending reports to the vehicle's display unit about tire pressure Module has the following: Pressure sensor, accelerometer, temperature sensor, low-frequency radio, Microcontroller   Featured NXP Products FXTH87 product page FXTH87 Fact Sheet Links Tire Pressure Monitoring Sensors Pressure Sensors Block Diagram  
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Demo Wheel rotation is controlled by the SB0400 DC motor pre-driver. When the wheel is stopped manually, the Wheel Speed Sensor -KMI23- detects it & sends a signal to the SB0400 motor pre-driver & S32K MCU to activate the electromagnet Products 32-bit Automotive General Purpose MCUs|NXP Motorcycle Two-Wheel Antilock Braking (ABS)|NXP KMI23_KMI25|NXP  Links Motorcycle Two-Wheel Antilock Braking (ABS)|NXP  Analog Expert Software and Tools|NXP  Recommended product Link S32K144EVB https://www.nxp.com/design/development-boards/automotive-development-platforms/s32k-mcu-platforms/s32k144-evaluation-board:S32K144EVB?&fsrch=1&sr=1&pageNum=1
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Demo The MC33SB040X familly is an antilock brake controller designed especially for two wheeler system. Thanks to the plug and play evaluation module controlled by a friendly graphical unit interface, we will show the potential of our product.  Through this demo, we will demonstrate how it is easy to use our solutions and accelerate the development of a complete ABS Motorcycle / Scooter solution.   First Motorcycle ABS IC Familly One Channel ABS IC for Scooters - Two Channels ABS IC for Motorcycles Smallest ABS Package - Low RDSon Low Side Drivers Featured NXP Product http://cache.freescale.com/files/analog/doc/brochure/BR1569.pdf  
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NXP's secure over-the-air communication for automotive networks features embedded hardware crystallographic engine for the rapid decryption of received data.   Features   MPC5748G targets High-End Body and High-End gateway Rich communication peripheral set & HSM - embedded Security Module Encryption, decryption, message code generation, secured flash memory for secured storage Secured communication inside or outside the vehicle (wired or wireless) Encryption with different algorithms demo Decryption in both hardware (HSM) or software comparison Links High End Body Control Module Central Gateway / In-Vehicle Networking Block Diagram  
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i.MX RT1170 crossover MCUs are part of the Edge Verse™ platform and are setting speed records at 1 GHz. This ground-breaking family combines superior computing power and multiple media capabilities with ease-of-use and real-time functionality. For reducing the overall system cost, RT117x didn't have embeded flash, need external Flash as program storage and XIP place, NXP and third party like IAR, KEIL and Segger all provide mature tool to make Nor Flash‘s programing with their own flashloader, can fulfillment most customer’s application requirement, but still some users need to customize the flash programing algorithm due to programing speed optimization and difference of the nor Flash from different vendor and, such as SFDP support, QE bit's position, default sector size, DDR/OPI/QPI feature, default 3 Bytes/4 Bytes mode and also operating sequence, but the default Flashloader is based on the ROM API, it's hard to debug and customize as there is no source code. This reference demo will use source code Flash operation API instead of ROM API. In addition, it also add two new useful feature, first one is current Flashloader framework can't support some nor flash which need pre-configuration, such as Cypress's S25HL01GT, its sector size is not unified, need to config additionally. This reference demo give some function interface to implement it with 3 bytes/4bytes command mode and DDR/SDR mode, it also improve the original framework by adding read-erase-write demonstration code, which can help user to verify their customized Flashloader without need to copy to IDE every time, improve the efficiency greatly. Second advantage is it can support download flow‘s log generation, by default there is no log info in overall download flow, hard to locate which step(get configure/init/erase/program/verify) the failure occur, this demo code add log function to record every detailed download step, by which users can optimize their download speed, it's helpful for mass production. Developers can also debug and customize depend on their own specific requirement and different nor Flash.
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结合MPC5748G的Lifecycle机制,阐述如何使用Lifecycle机制来满足在开发阶段及最终消费阶段对各利益相关方的数据进行保护的需求,比如Tier1的IP(知识产权)、OEM的一些标定参数、车主的个人隐私等。并介绍Lifecycle在每个阶段所支持的主要安全特性及如何配置使用。
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EEPROM selection guide for serial RCON boot. On S32G reference manual, we only ask customer to make sure I2C address of EEPROM is 0xA0, no others requirement. Actually, S32G only supports EEPROM with one 8-bit address byte. For high capacity EEPROM such as AT24C64D@8K bytes, which need two 8-bit word address bytes. Can’t be supported by S32G ROM.   AT24C64D.pdf         AT24C01 has been validated on S32G EVK board, which need one word address byte AT24C01.pdf   Thanks, Lambert
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This document introduce how to do LPDDR4 DQ Swapping in S32G platform.
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This article explains the details and customization of the S32G M7 core Standby demo. And how to porting to Autosar Mcal demo. Contents 1    Description of reference materials. 2 2    Demo creation and running process. 2 2.1  Demo checkpoints. 2 2.2  The difference between Standby and StandbyRAMboot 4 3    S32G Standby principle and Code Description. 5 3.1  Peripheral initialization function. 5 3.2  standbyramc_cpy(optional) 5 3.3  WKPU_set 8 3.4  standby_modechange. 13 4    VR5510 PMIC Standby principle and code description. 15 4.1  PMIC_initConfig. 15 4.2  PMIC_standbyEntry. 17 5    Customization modification. 18 5.1  Do not enable RTC wakeup feaure. 18 5.2  Eable CAN1_RX wakeup feature. 19 5.3  Only support full boot 21 5.4  Open the DDR related power 21 5.5  Modify debug serial port to UART1. 24 5.6  Modify the device drive clock. 26 5.7  close other non-main core. 30 6    Build a new MCAL demo. 34 6.1  Modify the UART driver 35 6.2  Implement the clock shutdown code. 36 6.3  Configure the power mode switching driver 37 6.4  Confgure the wakeup source. 42 6.5  Add PMIC driver 51 6.6  Main function call routine. 59 6.7  Test 61 6.8  Future development plan. 62 本文说明S32G M7核Standby demo 详细情况及定制,以及如何新建一个mcal demo 录 1    参考资料说明... 2 2    Demo创建运行过程... 2 2.1  创建运行... 2 2.2  Standby和StandbyRAMboot的区别... 4 3    S32G Standby原理与代码说明... 5 3.1  外设初始化函数... 5 3.2  standbyramc_cpy(可选) 5 3.3  WKPU_set 8 3.4  standby_modechange. 13 4    VR5510 PMIC Standby原理与代码说明... 14 4.1  PMIC_initConfig. 14 4.2  PMIC_standbyEntry. 16 5    定制修改... 17 5.1  关闭RTC唤醒功能... 17 5.2  打开CAN1_RX唤醒功能... 19 5.3  只支持full boot 20 5.4  打开DDR相关电源... 21 5.5  修改调试串口为UART1. 23 5.6  修改设备驱动时钟... 25 5.7  事先关掉所有其它的非主核... 29 6    修改为MCAL Demo. 33 6.1  修改UART驱动... 34 6.2  实现时钟关闭代码... 35 6.3  配置电源模式切换驱动... 36 6.4  配置唤醒源... 41 6.5  加入PMIC驱动... 50 6.6  主函数逻辑实现... 58 6.7  运行测试... 60 6.8  未来开发计划... 61   attachment include chinese/english doc, s32ds codes with 2 zip package(remove the .7z), mcal codes.  
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FAST BOOT FOR lx2160 IN adas •Objective To speed ​​​​up bringup of LX2 chip-based systems •Pain Points to Address The bringup time is much longer than 3s, which is very sensitive in ADAS systems or time-sensitive systems. •Value Proposition / Key Features The guide can help customers shorten uboot time from 5s to less than 1.5s, saving more than 70% bootup time. •Deliverables Demo based on LX2160ARDB board. Reference codes and patches. Guide for Fast boot document. Fast boot 广泛用于嵌入式设备,现以lx2160ardb板为例进行相关探索。 启动流程: 优化思路: 1.适当提高FSPI时钟速率 diff --git a/lx2160asi/flexspi_divisor_32.rcw b/lx2160asi/flexspi_divisor_32.rcw index 422139c..0f8d5c9 100644 --- a/lx2160asi/flexspi_divisor_32.rcw +++ b/lx2160asi/flexspi_divisor_32.rcw @@ -7,8 +7,10 @@ * Modify FlexSPICR1 register, to increase FlexSPI clock closer to 50MHz, * with divisor value as 32. * => 750 * 2 / 32 ==> 46.875MHz + *write 0x1e00900,0x00000013 + * 0f -12 =125M */ .pbi -write 0x1e00900,0x00000013 +write 0x1e00900,0x0f .end ​ 2.关键路径优化 固化spd参数 固化ddrc参数 BL33 裁剪 详细patch和测试结果参考附件。
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  本文说明S32G  RDB2板Linux板级开发包BSP32 的ATF细节,以帮助客户了解S32G的ATF是如何运行的,以及如何修改到客户的新板上。   从BSP32开始,默认启动需要ATF支持,所以部分定制需要移动到ATF中,Uboot会简单很多。 请注意本文为培训和辅助文档,本文不是官方文档的替代,请一切以官方文档为准。   目录如下: 目录 1    S32G Linux文档说明... 2 2    创建S32G RDB2 Linux板级开发包编译环境... 3 2.1  创建yocto编译环境: 3 2.2  独立编译... 8 3    NXP ATF 原理... 13 3.1  AArch64 Exception Leve: 13 3.2  ATF原理... 14 3.3  ATF目录 结构... 16 3.4  ATF初始化流程... 25 3.5  NXP ATF的SCMI支持... 28 3.6  NXP ATF的PSCI支持... 32 3.7  NXP ATF OPTEE接口(未来增加)... 36 4    ATF 定制... 36 4.1  修改 DDR配置... 36 4.2  修改调试串口与IOMUX定制说明... 39 4.3  启动eMMC定制说明... 48 4.4  I2C与PMIC定制说明... 58
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本文说明在S32G2 RDB2板上实现LLCE to PFE Demo的搭建过程。本Demo目前包括:  CANtoEth:CAN0发送,用硬件回环到 CAN1接收,然后通过PFE_EMAC1, 再通过RGMII接口发出。  CANtoEth:CAN0发送,用硬件回环到 CAN1接收,然后通过PFE_EMAC1, 再通过SGMII接口发出。  EthtoCAN:PC通过PFE_EMAC1的 RGMII发出,接收到CAN1,再硬件 回环到CAN0  CANtoCAN Logging to Eth: CAN0发 送,用硬件回环到CAN1接收,然后 通过PFE_EMAC1,再通过SGMII接 口发出,同时LLCE内部硬件把CAN1 再发送到CAN15_TX,再用硬件回环 到CAN14_RX 软件版本为 RTD3.0.0+LLCE1.0.3+PFE0.9.6/0.9.5。
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This doc explain how to support a new QSPI nor for boot, SDK and Linux, Contents as follows: 目录 1 硬件设计 .................................................................... 2 2 所需工具和相关资料 .................................................. 5 3 ROM Code的启动流程 ............................................... 5 4 S32G QSPI NOR flash配置表头定制 ......................... 7 4.1 S32G QSPI NOR启动配置表信息 .......................... 7 4.2 目前支持的配置表头分析说明 ............................... 10 4.3 LUT构成与Flash write Data说明 ........................... 16 4.4 具体分析已有的配置表头的LUT与Flash write Data的 配置方法 ...................................................................... 22 4.5 支持一款新的QSPI NOR Flash示例1:Micron........ 28 4.6 支持一款新的QSPI NOR Flash示例2:Winbond .... 31 5 使用IVT打包配置头 .................................................. 33 6 使用IVT工具中的flash image工具烧写镜像到QSPI NOR 中 34 7 软件定制M7 ............................................................. 35 8 软件定制uboot ......................................................... 37 9 软件定制Linux Kernel .............................................. 40 9.1 支持美光8bit DDR 模式(未验证) .......................... 44 9.2 支持1bit SDR fast read 模式 ............................... 46 10 Debug过程中需要注意的几点 .................................. 49 10.1 启动时ROM Code读取QSPI NOR时钟仅有12Mhz左 右 49 10.2 比较大的镜像如果不加参数头,无法从QSPI-NOR上启 动 55
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This doc explain how to optimize the Linux boot time, Contents as follows: 目录 1 默认BSP28 Linux内核的启动时间分析和优化方向 ..... 2 2 UBoot的优化 .............................................................. 3 2.1 缩小Uboot的DTS尺寸 ............................................ 3 2.2 缩小Uboot的尺寸 .................................................... 4 2.3 去掉等待3S输入时间 .............................................. 4 2.4 配合内核修改的Uboot参数 ..................................... 4 2.5 关闭串口调试信息 .................................................. 5 2.6 MMC read的方法来读取内核和DTB ....................... 5 3 Kernal的优化 ............................................................. 5 3.1 DTB中去掉不用的驱动和代码 ................................. 5 3.2 内核中去掉不用的平台与驱动及相关代码 ............... 6 3.3 内核中去掉不用功能,缩小内核大小 ...................... 7 3.4 去掉initramfs支持 ................................................... 7 3.5 关闭调试信息 .......................................................... 7 3.6 提前eMMC驱动加载时间 ........................................ 7 3.7 将Kernel与DTB打包在一起..................................... 8 4 Rootfs+应用程序的优化 ............................................. 8 5 最终全部启动时间比较 ............................................. 12
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This doc expain how to use eMMC from user space, contents as follows: 目录 1 eMMC的分区情况 ...................................................... 2 2 S32G+BSP29上默认的eMMC启动 ............................ 3 2.1 eMMC硬件设计 .................................................. 3 2.2 eMMC的镜像烧写办法与启动 ............................. 6 2.3 增加MMC内核测试工具 .................................... 10 3 eMMC GP功能的测试 .............................................. 10 3.1 eMMC GP功能的说明 ....................................... 10 3.2 eMMC GP功能的测试 ....................................... 11 4 eMMC RPMB功能的测试 ......................................... 13 4.1 eMMC RPMB功能的说明 ................................. 13 4.2 eMMC RPMB功能的测试 ................................. 15
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This doc explain our Linux BSP driver and how to custom them. Contests as follows: include bsp30/32 目录 1 S32G Linux文档说明 ................................................. 2 2 创建S32G RDB2 Linux板级开发包编译环境 .............. 2 2.1 创建yocto编译环境: ................................................ 2 2.2 独立编译 ................................................................. 8 3 Device Tree ............................................................. 11 3.1 恩智浦的device Tree结构 ..................................... 11 3.2 device Tree的由来(no updates) ............................ 13 3.3 device Tree的基础与语法(no updates) ................. 15 3.4 device Tree的代码分析(no updates) .................... 37 4 恩智浦S32G BSP 包文件目录结构 .......................... 70 5 恩智浦Linux BSP的编译(no updates) ...................... 72 5.1 需要编译哪些文件 ................................................ 72 5.2 如何编译这些文件 ................................................ 73 5.3 如何链接为目标文件及链接顺序 ........................... 74 5.4 kernel Kconfig ...................................................... 76 6 恩智浦BSP的内核初始化过程(no updates) .............. 76 6.1 初始化的汇编代码 ................................................ 78 6.2 初始化的C代码 ..................................................... 82 6.3 init_machine ......................................................... 94 7 恩智浦BSP的内核定制 ............................................. 97 7.1 DDR修改 .............................................................. 98 7.2 IO管脚配置与Pinctrl驱动 .................................... 100 7.3 新板bringup ........................................................ 121 7.4 更改调试串口 ...................................................... 125 7.5 uSDHC设备定制(eMMC flash,SDcard, SDIOcard) 129 7.6 GPIO驱动 ........................................................... 137 7.7 GPIO_Key 驱动定制 .......................................... 145 7.8 GPIO_LED 驱动定制 ......................................... 150 7.9 芯片内thermal驱动 ............................................. 155 7.10 CAN接口驱动 ..................................................... 157 7.11 I2C及外设驱动 .................................................... 162 7.12 SPI与SPI Slave驱动 ........................................... 183 7.13 Watchdog test. ................................................... 190 7.14 汽车级以太网驱动定制 (未验证) (未完成) ........... 191
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目录 1 S32G Linux文档说明 .................................................. 3 2 创建S32G RDB2 Linux板级开发包编译环境 .............. 4 2.1 创建yocto编译环境: ................................................. 4 2.2 独立编译 ................................................................. 9 3 FSL Uboot 定制 ........................................................ 14 3.1 FDT支持 ............................................................... 14 3.2 DM(driver model)支持 ........................................... 20 3.3 Uboot目录结构 ...................................................... 31 3.4 Uboot编译 ............................................................. 34 3.5 Uboot初始化流程 .................................................. 35 3.6 使能了ATF后对Uboot初始化流程的影响 ............... 40 4 Uboot 定制 ............................................................... 41 4.1 修改 DDR大小 ....................................................... 41 4.2 修改调试串口与IOMUX说明 .................................. 44 4.3 DM I2C与PMIC初始化 .......................................... 53 4.4 通用GPIO ............................................................. 59 4.5 启动eMMC定制 ..................................................... 69 4.6 Ethernet定制 ......................................................... 78 5 Uboot debug信息 ..................................................... 89 5.1 Print env ............................................................... 89 5.2 dm - Driver model low level access ...................... 92 5.3 fdt .......................................................................... 95 5.4 I2C测试 ................................................................. 95 5.5 芯片寄存器访问 ..................................................... 98 updated to V5
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This doc explain our Mcal driver and how to custome them. contents as follows: 目录 1 AutoSAR MCAL基本概念 .......................................... 2 1.1 AutoSAR目标 ......................................................... 2 1.2 AutoSAR概念 ......................................................... 2 1.3 AutoSAR基本方法 .................................................. 2 1.4 BSW(Basic Software) ............................................. 4 1.5 NXP Basic AutoSAR软件 ....................................... 4 1.6 RTE与BSW的配置 ................................................. 5 1.7 BSW的配置流程 ..................................................... 6 1.8 MCAL驱动 .............................................................. 7 2 MCAL工具 ................................................................. 7 3 MCAL说明 ................................................................. 8 3.1 MCAL的下载与说明 ................................................ 8 3.2 EB Tresos的下载,安装 ....................................... 13 3.3 RTD-MCAL安装 ................................................... 16 3.4 Trace32的下载与安装 .......................................... 18 3.5 样例工程的编译,运行 ......................................... 20 4 MCAL驱动配置与定制 ............................................. 40 4.1 MCU ..................................................................... 45 4.2 PORT ................................................................... 59 4.3 DIO ....................................................................... 69 4.4 FlexCAN ............................................................... 71 4.5 FlexLin ................................................................. 87 4.6 GMAC .................................................................. 93 4.7 I2C ..................................................................... 101 4.8 PMIC .................................................................. 108 4.9 PMIC WDOG ...................................................... 127 4.10 WDOG ............................................................... 137 4.11 UART ................................................................. 144 4.12 SPI ..................................................................... 149 4.13 PWM .................................................................. 165 4.14 ADC ................................................................... 171 4.15 Thermal .............................................................. 177
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