NFC wafer IC integration (NTAG216 or similar)

[ManuelG_Eurecat]

Good morning,

My company has functional inks printing capabilities and we're trying to develop custom smart labels whith NFC functionallity. I have found the NTAG216 and similar ICs and we would like to know how these chips can be integrated, as I cannot find many info about it. We have already tested bigger ICs (TSSOP-8 and similar) with our custom printed antennas, and now we want to reduce the size of the design and improve the versatility of the final product. I kindly ask for some help with the integration of this kind of ICs.

Many thanks and best regards,

Manuel

[estephania_mart · Accepted solution]

You can see the recommendation on the application note AN106920

• “Handling and processing of sawn wafers on UV dicing tape”

Also you can check the AN10706

• Handling bare die

There is more information on the matter, still, that is under NDA and you will need to request the information through DocStore.

Also, you will need to contact one of our distributors available in the  Distributor Network|NXP to help you through the NDA process.

Regards,

Estephania