HI sir,
We are working NFC chip of Ntag216 & 213 to make flip-chip process into etching antenna inlay, a question about the chip connect position, if bump LA to connect with GND and LB to connect TP (as like photo) is it can work function? have any risk?
Hi Rod,
The LA and LB are Antenna connection LA and Antenna connection LB.
Should not connect other pads with them.
Please refer the NTAG IC connections of NTAG Antenna Design Guide.
Best Regards,
Robin
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