Hello,
I am working with the CLRC66303 connected to a TI CC2652R7 MCU over I²C only.
According to the datasheet and the official NXP reference board, the hard power-down current should be around 10–30 µA.
On the official NXP CLRC66303 board, I measure ~30 µA (as expected).
On my custom I²C-only board, I always measure ~700 µA in hard power-down.
Test conditions:
Supply: 3.3 V
Interface: I²C only (SCL, SDA, IRQ with 4.7 kΩ pull-ups)
MCU: TI CC2652R7
PWRDOWN pin controlled correctly by MCU
Firmware sequence is identical to the NXP reference board
Measurement with precision multimeter
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My design (attached schematic):
Based on official NXP CLRC66303 reference
IFSEL0, IFSEL1, IFSEL2 pulled high (4.7 kΩ) → I²C-only mode (address 0x50)
SCL, SDA lines with 4.7 kΩ pull-ups
IRQ line with 4.7 kΩ pull-up
Crystal 27.12 MHz with proper load capacitors
Decoupling capacitors on AVDD, DVDD, TVDD present
SPI pins (NSS, MOSI, MISO, SCK) not connected (floating, since only I²C is used)
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Questions:
1. Is there any predefined NXP firmware step or register setting required before asserting PWRDOWN to achieve the specified 10–30 µA current?
2. For I²C-only designs, are there any hardware or layout changes recommended beyond the reference schematic?
3. Could the unused SPI pins (left floating) be causing leakage in hard power-down? Should they be tied to GND or VCC?