Hello @rsating,
Thank you for all the details provided in this thread, I have identified the issue, but I need to contact the RappId bootloader team. Let me explain.
Unfortunately, the QSG you are mentioning refers to a previous version of or toolbox, the 3.0.0. The QSG for the 3.2.0 can be found directly in our toolbox, but I will attach it to this response. It contains an additional step for the MC5775B/E and MPC5777C which requires the usage of an alternative algorithm for flashing the bootloader only. But I think you already know this because you've found it on another thread on the community.

Now, the bootloader part.
The process is like this: The user flashes the bootloader on the board, which after reset, waits for the new firmware over the serial to be sent from the Simulink model, or from the RappID bootloader tool.
But the bootloader delivered with the toolbox is configured to wait over the eSCI_A, pins 89, 90. These pins are used as the main serial connection routed to USB on the majority of the evaluation boards for the MC3377x parts. But the board you have, has the the eSCI_C, pins 244 and 245, while the e_SCI_A has been routed to a LIN transceiver.


https://www.nxp.com/webapp/Download?colCode=RDVCU5775EVM_SCH
So this is the reason why the bootloader is not working: it wait s the code on another serial instance.
Now, I will contact the RappId bootloader team and reply with a response here, related to the Bootloader version.
Until then, you can bypass the Bootloader flashing method by using the S32DS. Basically, you have to m manually flash the Simulink generated code using the S32DS.
The easiest way to do that is to import an example for the MPC5777C, let's say Hello World. (Go to File -> New -> S32DS Project from Example)

Then go to debug, select the new created project, go to Browse and select the generated .elf by the SImulink project. Disable the autobuild and press Debug.

Now the code should be deployed on the board and the code should run.
Hope this helps,
Marius