Hi.
I'm working with re-balling a MPC5554. During the process, I managed to cause som slight mechanical damage to the edge of the chip. When reviewing this under the microscope, I noticed there are multiple small traces going from multiple pads all the way to the edge of the chip. I've damaged some of these traces.
My question is, what are these traces? What is their purpose? Does it matter if they are slightly damaged? They don't really seem to go anywhere....
Thanks in advance.
That's interesting question.
It guess it goes to the test terminals during MCU manufacturing that are removed at the end of the process.
I don't expect a slight damage as you shown on the picture would affect the MCU if there is no other damage there.
That sounds plausible.
Thank you!