Hi FedericoWegher,
Really thanks so much for your patient and understanding.
Today, I checked your issues again, and test the temperature_collector and the temperature_sensor.
1. About the FlexNVM
Your attached picture should just from the P&E debugger, P&E debugger associate with MCUXPresso IDE has it, the other debugger, eg, JLINK don't have it.
And to kw38 chip, FlexNVM is not the Pflash, I am afraid the debugger interface can't realize the preserve function to the FlexNVM as Dflash.
Please check the KW38 memory map with FlexNVM as Dflash.

But, I think, if you really want to perserve the FlexNVM data, you also can use the flash driver, use the Flash commander to write it in the app code.
Take an example, after boot, check the related FlexNVM area, if it is all 0XFF, then you can write the flash commander to write that area to your orginal data.
I also debug my temperature_collector, in your mentioned FlexNVM also don't have the data, it all are 0XFF

2 About code function
Could you tell me why you need that flexnvm area, as when I test it directly, even I don't have that area, I still can bond, two boards works OK, one as collector, another as sensor.
This is my test result:

Do you test the SDK two project directly? As I check your mentioned NVM region, no data, I still can make it works.
I think maybe your issue is not caused by this area.
Do you have two NXP FRDM-KW38 board, can you test it again whether it works?
If you already use the FRDM-KW38 board, can you tell me how to reproduce your issues, as I still can realize bond.
Any updated information from your side, just kindly let me know.
Best Regards,
Kerry