ls1046ardb开发裸板上可以烧写flexbuild_lsdk2108_github.tgz解压之后编译得来的sd_uboot.img吗
lsdk2108官网上下载的sd_uboot.img烧进去可以起来,我自己解压编译的烧进去就起不来(没有任何串口打印)
这两个有什么区别吗,如果没有,那是我编译的时候哪里配置不对吗
flex-build -b sd -m ls1046ardb -i mkfw.
the *_sd.image should work,more info see the docs: https://www.nxp.com/docs/en/user-guide/LSDKUG_Rev21.08.pdf
If you are located in China and working on a non-verification project that has the potential for mass production, you can contact local distributors who can provide you with detailed design proposals and reference information.
再次求助,有没有人指点一下方向,或者遇到过类似的问题,提供一下解决思路