Are there any plans for releasing the LS1021A in a lidded package, for use in an automative or outdoor industrial environment?
We have a robust passive heat sink solution worked out for use with the LS1021A's 525-pin FC-PBGA lidless package. However we have concerns about moisture ingress and possible damage this may cause to a processor in lidless form. Normally we conformally coat all our circuit boards (PCBAs) before mounting them in their enclosures or in certain cases completely seal the modules (housing the circuit boards) to IP65 rating.
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There are no plans to offer LS1021A's in a lidded package.
Have a great day,
Andrei
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There are no plans to offer LS1021A's in a lidded package.
Have a great day,
Andrei
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Note: If this post answers your question, please click the Correct Answer button. Thank you!
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