Hello to everyone, i'm using th uC MKM35Z512VLL7.
I have a PCB where SMD components are mounted on the top LA and bottom LB sides.
On the TOP side LA, the MKM35Z512VLL7 microcontroller (IC1) is soldered. On the BOTTOM side, a very tall and heavy component is soldered (Relay RL2).
For issues with component (RL2), before we solder the microcontroller IC1 on side LA. Then after we solder component (RL2) on side LB.
Therefore, the microcontroller (IC1) will go through TWO stages in the SMD soldering oven.
The soldering profile is according to the IPC/JEDEC Standard J-STD-020 with T(max)=+260°C.
Can I have problems with the microcontroller if it goes through two cycles in the reflow oven?
thanks
Ivan