HW DESIGN:
The QFN-24 case provides a central PAD, which is probably used for thermal reasons. I was not able to find where this PAD should be connected: should it be connected to GND or should it be left unconnected?
Thank you in advance, Luca
Solved! Go to Solution.
Hi
This question has been asked many times and there are many responses at the forum too. Eg. one from 5 years ago: https://community.nxp.com/message/317841
I suppose the answer is the same for all Kinetis parts and I never understood why this is not documented in the data sheet, which would save many engineers worrying about getting it wrong.....
Regards
Mark
Hi
This question has been asked many times and there are many responses at the forum too. Eg. one from 5 years ago: https://community.nxp.com/message/317841
I suppose the answer is the same for all Kinetis parts and I never understood why this is not documented in the data sheet, which would save many engineers worrying about getting it wrong.....
Regards
Mark
Yes, it seems it's not well documented.
May be I've not read the documents so carefully, but I was not able to find any indication. An upgrade by NXP would be appreciated.
Thank you very much,
Luca
The recommendation is connected to ground, please check AN2467 Power quad flat no-lead (PQFN) package.
Best Regards,
Robin
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Hello Robin.
Sorry, I don't see your answer (may be you linked something, but it's not visible in the message).
Could you check?
Thank you in advance,
Luca
Sorry!
I have fixed the reply.