Hi I am using your new Processor MK27FN2MOVMI15. the pitch is 0.65 . I want to know what is the smallest Via size Pad and Hole size that I can use, for production of these Boards. We want to mechanically Drill, as this keeps the board cost down.

[lesliehooker]

[Hui_Ma]

Hi,

There is an application note AN4982 about MAPBGA package.

More detailed info please check here.

For pitches at or below 0.65 mm, the solderable diameter is generally larger than one-half pitch in diameter:

Wish it helps.

Have a great day,
Mike

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[lesliehooker]

Thanks but my question is do I have to go Micro-via.  or can i have a via in the channel to escape tracks out. Much appreciated.

[Hui_Ma]

Hi,

Sorry for the later reply.

Please refer the FRDM-K28F board PCB design files from below link:

FRDM-K28F - Printed Circuit Board bill of Materials and Design Files

FRDM-K28F|Development Board|Kinetis K27/K28|NXP 

There provides the MK28FN2M0VML15 chip BGA fan-out reference design.

Wish it helps.

Have a great day,
Mike

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Note: If this post answers your question, please click the Correct Answer button. Thank you!
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[lesliehooker]

That's Great, thank you very much for all your help, take care.