Baking requirement for S9KEAZ128AMLH

表示  限定  | 次の代わりに検索 

Baking requirement for S9KEAZ128AMLH

Contributor I


We have several S9KEAZ128AMLH components in an opened static control bag and are about to put them into a production run. The bag has been open for an unknown amount of time with ambient humidity of 60-80%.

  1. What are the concerns if we don't bake the component before reflow?
  2. If we hand solder the component, do we alleviate these concerns?

Thank you!

0 件の賞賛
1 返信

NXP TechSupport
NXP TechSupport

Hi, @diegorpd 


Thanks a lot for your patience.


I hope you are well. Answering your first question, the concerns are that you can create bubbles into de component by not baking it before reflow, and your component can be damaged. Regarding your second question, it is highly recommended to bake it before hand soldering too, for the same reason of moisture inside the component.


Please let me know if you have more questions.


Best regards.

Pablo Avalos.

0 件の賞賛