Connected and smart devices have been part of many visions for the last decade, but we are closer to the tipping point now than ever before. Part of this tipping point is related to enabling the explosion in the wearables market. In this session, we will define the wearables market, identify the key challenges and needs related to this market and discuss technologies that will spur innovation and growth. We'll walk through the new Wearables Reference Platform (WaRP) board which incorporates a hybrid architecture with an i.MX application processor and a Kinetis MCU to provide flexibility and scalability. WaRP also incorporates sensor and wireless technologies from Freescale for further capabilities. WaRP board is a collaboration between Freescale and development partners to enable you to take the concept beyond the marketing buzz to an end product. Presented by Robert Thompson Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-HCW-T1031

This session will discuss the challenges of supporting multiple execution environments on embedded systems and advocate heterogeneous multiprocessing (HMP) as an effective solution to those challenges. The i.MX architecture will evolve to support HMP based on the integration of ARM Cortex-A and Cortex-M processors into a single SoC. This session will introduce the HMP architectural features available on next-gen i.MX designs, including resource sharing/isolation, interprocessor communication and interprocessor synchronization. Presented by Rob Cosaro Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-SHB-T1036

The training will focus on the DDR controller used in the i.MX53 and i.MX6 series processors. It will include operation, register programming and calibration techniques to properly tune the various DDR types supported: LPDDR2, DDR2 and DDR3. Hardware layout considerations will also be discussed. Presented by Mark Middleton Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-DES-T1060

Presented by Stanley Huang Presented at MCU and Automotive Solutions, Tianan - 19 March 2015

This session provides an introduction to a new unified bootloader solution for Kinetis MCUs. An overview of the bootloader and accompanying  utilities will be provided along with a live demo of some common bootloader use cases. Presented by Anthony Huereca Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-DES-T1057

This session covers thermal mechanical design options for routing and dissipating heat within an enclosure that utilizes the i.MX 6Quad processor. Additionally, the course will cover passive thermal options such as graphite paper, thermal pads, the pros/cons of metal heat spreaders like copper and suggestions for implementation based on which i.MX 6 series processor is being utilized. Presented by Asim Zaidi Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-DES-T1059

Presented by Istone Presented at DwF Digital Networking Shenzhen - January 28, 2015

This session provides an introduction to the new QorIQ LS1 family, the first family of devices in the QorIQ LS series based on dual ARM® Cortex®-A7 cores. You will receive an overview of the LS1 processors--advantages, differentiators and capabilities for networking and industrial applications. Presented by Hao Sun Presented at DwF Digital Networking Shenzhen - January 28, 2015 Session ID: APF-NET-T0162

PROFIBUS, CAN and RS232 are extensively used in communications networks in factories, buildings, transport infrastructures and monitoring/control equipment in our cities. Ethernet offers higher bandwidth and, in many cases, lowers cost--especially when deployed in daisy-chain topology. Technologies such as EtherCAT, PROFINET and EtherNet/IP are testament to this. In this session, we will explore how QorIQ processor families can help equipment manufacturers span this landscape using a QUICC Engine (QE) controller for UART/Ethernet-based protocol implementation, a Enhanced Triple Speed Ethernet Controller (eTSEC) for intelligent Ethernet classification and 2-port switching, and an eight-port gigabit Ethernet switch for wire-rate switching. Reference design software and hardware files will be available to help you start your own PROFIBUS and PROFINET designs. Presented by Hao Sun Presented at DwF Digital Networking Shenzhen - January 28, 2015 Session ID: APF-IND-T0049

Presented by Lan Zhou from Landzo Presented at DwF Kinetis MCUs Based on ARM® Technology Shenzhen - January 27, 2015

Presented by LIANG PING Presented at DwF Kinetis MCUs Based on ARM® Technology Shenzhen - January 27, 2015

Presented by Jerry Zeng Presented at DwF Kinetis MCUs Based on ARM® Technology Shenzhen - January 27, 2015

How Freescale's RF device portfolio can solve problems for many different industries. The focus on uses outside of the traditional cellular infrastructure and how Freescale devices bring unique capabilities to these application areas that include: Industrial Scientific Medical (ISM) applications, including laser, MRI and heating; Land mobile, including public safety, dispatch and remote monitoring; Avionics, including communication, navigation and radar systems. Presented by Yan Vainter Presented at DwF Tel Aviv - January 27, 2015 Session ID: EUF-IND-T0977

Freescale Connected Intelligence helps to bring the full potential of the IoT to life, delivering intelligence everywhere so designs and whole systems can scale and interact seamlessly and securely. This session will present the Freescale solutions addressing the challenges of IoT, with a focus on Wireless Connectivity platforms. Presented by Cyril Zarader Presented at DwF Tel Aviv - January 27, 2015 Session ID: EUF-IND-T0970

This session will provide an update on Freescale's analog portfolio and value proposition. It will cover industrial, automotive and consumer product families: MCU and system power management, analog power switches, battery and energy management, physical layer interfaces such as Chokeless CAN and isolated network transceivers, radar 77GHz and motor control and power drive. It will highlight safety features of the products as well as new enablement tools such as Tower board or Processor Expert analog software component. Presented by Emmanuel Carcenac Presented at DwF Tel Aviv - January 27, 2015 Session ID: EUF-IND-T0662