Discontinuation Notification
202103047DN : MCF5445X PBGA Part Number Migration due to Molding Change from Corner-Gate Mold (CGM) to Pin-Gate Mold (PGM)
Does this change to mold process affect the datasheet specs and/or design-use considerations? Is PN: MCF54455VP266 and pin-for-pin drop-in equivalent replacement for MCF54455VR266?
Do I need to change my PWB board footprint or alter my solder/assembly flow process?
Thanks for your help.