Pb of warpage during soldering on BGA LS1043AXN8PQB

[sandrine_feneyr]

The BGA's LS1043AXN8PQB have some default on balls after soldering : deformation and voids 

Do you have information on the same problem of warpage for other customers ?

Do you have special recommandations to avoid the warpage of this type of BGA without overmolding on the die ?

Thank you

Best regards

[TomE]

"LS1043AXN8PQB"? That's "QorIQ, 4xCPU 64-Bit ARM Arch":

LS1043AXN8PQB Product Information|NXP 

That's about as far from a Coldfire chip as you can get!

Please MOVE (option on edit somewhere) this post to a "place" where you're more likely to get an answer.

Tom