MCF54450VM240 Package and Coplanarity Specification

[joshua_hong]

Hi

with reference to the title:

1) What is the coplanarity spec for this BGA?

2) Based on the datasheet for dimension A1, it is stated min 0.27, max 0.47mm. Hence need to confirm is there possibility to have both solder ball of smallest size (0.27mm) and biggest ball size (0.47mm) exist inside one BGA.

3) Does NXP supply in HARD TRAY packaging during shipment for MCF54450VM240?

[vicentegomez]

Hi

1) What is the coplanarity spec for this BGA?

0.30 mm Please check note  5

2) Based on the datasheet for dimension A1,....

Yes, but if this is the case the body (plastic) of the device can only have  .10mm of variation in order to meet the .30mm of parallelism

 3) Does NXP supply in HARD TRAY packaging during shipment for MCF54450VM240?

what is a hard tray? a plastic tray? if this is the case the device is in a plastic tray.

I hope this will help you

Regards

Vicente Gomez