MPC8541EVTAPF

robert_twigg — Thu, 15 Nov 2018 11:46:19 GMT

HI there,

I am a technician who is looking to find a profile for installation and removal of P/N MPC8541EVTAPF in a BGA reflow machine, I cannot seem to find one anywhere online, our manufacturing department use a completely different method for installation so they are of no use. Is there anywhere I can find out these temperature/time settings.

Regards

Rob.

Re: MPC8541EVTAPF

andrei_skok — Fri, 16 Nov 2018 11:31:11 GMT

NXP does not provide recommended reflow profiles for good soldering -- NXP recommends customers obtain best profiles from their solder paste vendors. The "reflow profiles" that NXP uses in stressing / qual are much higher in temperature and longer in duration than typically makes good solder joints. Our profiles are intended to STRESS the component and thus are worst-case conditions, not ideal conditions for soldering (profiles used for stressing, because of high temp and long times would tend to dry out flux compared with actual optimized profiles that a solder paste vendor would likely recommend).

MPC8541 has FC-PBGA package so the following presentation can be used for more infromation: (slides 23-25)
https://www.nxp.com/docs/en/package-information/FC-PBGAPRES.pdf

Have a great day,
Andrei

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MPC8541EVTAPF

Re: MPC8541EVTAPF