topic Re: IMX8mini PCB material in Other NXP Products https://community.nxp.com/t5/Other-NXP-Products/IMX8mini-PCB-material/m-p/996974#M8352 <HTML><HEAD></HEAD><BODY><P>Thanks for your answer,</P><P>Another question I have is about the stackup. There is a contradiction between the BRD file and&nbsp;MX8MMHDG.pdf.</P><P>In the BRD file the copper thickness is 1Oz but in hardware design guide it is 0.5oz. the problem is that there are 3mils traces on those layers. Hows did manage to manufacture it? Can I build the stackup with 0.5oz?</P></BODY></HTML> Sun, 29 Dec 2019 21:58:54 GMT idom 2019-12-29T21:58:54Z IMX8mini PCB material https://community.nxp.com/t5/Other-NXP-Products/IMX8mini-PCB-material/m-p/996972#M8350 <HTML><HEAD></HEAD><BODY><P>Hi&nbsp;</P><P>I have a design with based on the IMX8mini with the LPDDR4, In your "i.MX 8M Mini Hardware Developer’s Guide"&nbsp;you&nbsp;<STRONG><EM>&nbsp;</EM></STRONG><A href="https://www.google.com/search?rlz=1C1GCEU_iwIL865IL865&amp;q=recommend&amp;spell=1&amp;sa=X&amp;ved=2ahUKEwiq2rjk77_mAhWK-6QKHRn3DjkQBSgAegQIDBAm" style="color: #660099; background-color: #ffffff; font-weight: 400; text-decoration: underline; font-size: 18px;">recommend</A>&nbsp;PCB material TU768, but the PCB manufacturer only have S1000-2,TG170.</P><P>Do you see any problem if I change the PCB material?</P></BODY></HTML> Wed, 18 Dec 2019 17:27:06 GMT https://community.nxp.com/t5/Other-NXP-Products/IMX8mini-PCB-material/m-p/996972#M8350 idom 2019-12-18T17:27:06Z Re: IMX8mini PCB material https://community.nxp.com/t5/Other-NXP-Products/IMX8mini-PCB-material/m-p/996973#M8351 <HTML><HEAD></HEAD><BODY><P>If the impedance matching it will be OK, but we still recommend you to use the HTG TU768,&nbsp; because the HTG TU768 with low dielectric loss.</P></BODY></HTML> Thu, 19 Dec 2019 09:15:26 GMT https://community.nxp.com/t5/Other-NXP-Products/IMX8mini-PCB-material/m-p/996973#M8351 Rita_Wang 2019-12-19T09:15:26Z Re: IMX8mini PCB material https://community.nxp.com/t5/Other-NXP-Products/IMX8mini-PCB-material/m-p/996974#M8352 <HTML><HEAD></HEAD><BODY><P>Thanks for your answer,</P><P>Another question I have is about the stackup. There is a contradiction between the BRD file and&nbsp;MX8MMHDG.pdf.</P><P>In the BRD file the copper thickness is 1Oz but in hardware design guide it is 0.5oz. the problem is that there are 3mils traces on those layers. Hows did manage to manufacture it? Can I build the stackup with 0.5oz?</P></BODY></HTML> Sun, 29 Dec 2019 21:58:54 GMT https://community.nxp.com/t5/Other-NXP-Products/IMX8mini-PCB-material/m-p/996974#M8352 idom 2019-12-29T21:58:54Z