<?xml version="1.0" encoding="UTF-8"?>
<rss xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:taxo="http://purl.org/rss/1.0/modules/taxonomy/" version="2.0">
  <channel>
    <title>Other NXP ProductsのトピックRe: Allowable void% on MRF1K50N solder joint?</title>
    <link>https://community.nxp.com/t5/Other-NXP-Products/Allowable-void-on-MRF1K50N-solder-joint/m-p/772201#M5851</link>
    <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Our general safe limit for maximum solder voiding specification is 25% total area voided max and no single void greater than 5%.&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;For thermal strained applications, for a decent solder mount void requirement under the flange is 40 mils "approximately round" max void area and no more than 15% total voided area. 40 mils can be replaced with a 3% max single void area and max 15% overall voiding.&lt;/P&gt;&lt;P&gt;&lt;BR /&gt;Have a great day,&lt;BR /&gt;Pavel&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;-----------------------------------------------------------------------------------------------------------------------&lt;BR /&gt;Note: If this post answers your question, please click the Correct Answer button. Thank you!&lt;BR /&gt;-----------------------------------------------------------------------------------------------------------------------&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
    <pubDate>Wed, 13 Jun 2018 11:00:01 GMT</pubDate>
    <dc:creator>LPP</dc:creator>
    <dc:date>2018-06-13T11:00:01Z</dc:date>
    <item>
      <title>Allowable void% on MRF1K50N solder joint?</title>
      <link>https://community.nxp.com/t5/Other-NXP-Products/Allowable-void-on-MRF1K50N-solder-joint/m-p/772200#M5850</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;We are trying to attach our MRF1K50N transistors to copper carriers using reflow soldering and wanted to know if you had a recommended or max allowable void% of the joint, so we know how much we need to improve our process and at what point we can call it successful.&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Mon, 11 Jun 2018 13:56:52 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Other-NXP-Products/Allowable-void-on-MRF1K50N-solder-joint/m-p/772200#M5850</guid>
      <dc:creator>joshterry</dc:creator>
      <dc:date>2018-06-11T13:56:52Z</dc:date>
    </item>
    <item>
      <title>Re: Allowable void% on MRF1K50N solder joint?</title>
      <link>https://community.nxp.com/t5/Other-NXP-Products/Allowable-void-on-MRF1K50N-solder-joint/m-p/772201#M5851</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Our general safe limit for maximum solder voiding specification is 25% total area voided max and no single void greater than 5%.&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;For thermal strained applications, for a decent solder mount void requirement under the flange is 40 mils "approximately round" max void area and no more than 15% total voided area. 40 mils can be replaced with a 3% max single void area and max 15% overall voiding.&lt;/P&gt;&lt;P&gt;&lt;BR /&gt;Have a great day,&lt;BR /&gt;Pavel&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;-----------------------------------------------------------------------------------------------------------------------&lt;BR /&gt;Note: If this post answers your question, please click the Correct Answer button. Thank you!&lt;BR /&gt;-----------------------------------------------------------------------------------------------------------------------&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Wed, 13 Jun 2018 11:00:01 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Other-NXP-Products/Allowable-void-on-MRF1K50N-solder-joint/m-p/772201#M5851</guid>
      <dc:creator>LPP</dc:creator>
      <dc:date>2018-06-13T11:00:01Z</dc:date>
    </item>
  </channel>
</rss>

