<?xml version="1.0" encoding="UTF-8"?>
<rss xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:taxo="http://purl.org/rss/1.0/modules/taxonomy/" version="2.0">
  <channel>
    <title>topic Re: MMRF5014H in Other NXP Products</title>
    <link>https://community.nxp.com/t5/Other-NXP-Products/MMRF5014H/m-p/695218#M5018</link>
    <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Please, refer to this application note:&lt;/P&gt;&lt;P&gt;Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages&lt;/P&gt;&lt;P&gt;&lt;A class="link-titled" href="https://cache.nxp.com/docs/en/application-note/AN1908.pdf" title="https://cache.nxp.com/docs/en/application-note/AN1908.pdf"&gt;https://cache.nxp.com/docs/en/application-note/AN1908.pdf&lt;/A&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;&lt;BR /&gt;Have a great day,&lt;BR /&gt;Pavel&lt;BR /&gt;NXP TIC&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;-----------------------------------------------------------------------------------------------------------------------&lt;BR /&gt;Note: If this post answers your question, please click the Correct Answer button. Thank you!&lt;BR /&gt;-----------------------------------------------------------------------------------------------------------------------&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
    <pubDate>Thu, 05 Oct 2017 14:10:23 GMT</pubDate>
    <dc:creator>LPP</dc:creator>
    <dc:date>2017-10-05T14:10:23Z</dc:date>
    <item>
      <title>MMRF5014H</title>
      <link>https://community.nxp.com/t5/Other-NXP-Products/MMRF5014H/m-p/695217#M5017</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Do you have installation and rework instructions for MMRF5014H?&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Thu, 28 Sep 2017 22:10:16 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Other-NXP-Products/MMRF5014H/m-p/695217#M5017</guid>
      <dc:creator>jeffreyramos</dc:creator>
      <dc:date>2017-09-28T22:10:16Z</dc:date>
    </item>
    <item>
      <title>Re: MMRF5014H</title>
      <link>https://community.nxp.com/t5/Other-NXP-Products/MMRF5014H/m-p/695218#M5018</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Please, refer to this application note:&lt;/P&gt;&lt;P&gt;Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages&lt;/P&gt;&lt;P&gt;&lt;A class="link-titled" href="https://cache.nxp.com/docs/en/application-note/AN1908.pdf" title="https://cache.nxp.com/docs/en/application-note/AN1908.pdf"&gt;https://cache.nxp.com/docs/en/application-note/AN1908.pdf&lt;/A&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;&lt;BR /&gt;Have a great day,&lt;BR /&gt;Pavel&lt;BR /&gt;NXP TIC&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;-----------------------------------------------------------------------------------------------------------------------&lt;BR /&gt;Note: If this post answers your question, please click the Correct Answer button. Thank you!&lt;BR /&gt;-----------------------------------------------------------------------------------------------------------------------&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Thu, 05 Oct 2017 14:10:23 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Other-NXP-Products/MMRF5014H/m-p/695218#M5018</guid>
      <dc:creator>LPP</dc:creator>
      <dc:date>2017-10-05T14:10:23Z</dc:date>
    </item>
  </channel>
</rss>

