SL3S1206FUD2/HA

yy12 — Fri, 07 Aug 2026 03:03:48 GMT

Request for Good Die identification documentation / Wafer Map

Dear Supplier,

We would like to confirm whether you have provided any documentation or markings that distinguish “Good Die” from “NG Die” on the wafer.

Specifically, we are looking for:

A wafer map (indicating which die passed/failed testing),
A test result report, or
Physical markings on the wafer surface (e.g., ink dots, laser marks) that clearly identify usable die.

After inspecting the wafer under our microscope, we could not find any visible physical markings. This raises concerns that we may not be able to reliably differentiate good die from defective die.

Could you please help check whether such information was included with the shipment, or assist us in obtaining these materials from the manufacturer? We need this data for our subsequent processing steps.

Thank you for your kind assistance. We look forward to your reply.

topic SL3S1206FUD2/HA in Other NXP Products

SL3S1206FUD2/HA