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    <title>Other NXP ProductsのトピックRe: PCF85176</title>
    <link>https://community.nxp.com/t5/Other-NXP-Products/PCF85176/m-p/2086271#M28426</link>
    <description>&lt;P&gt;Hello &lt;SPAN class="UserName lia-user-name lia-user-rank-Fresh-Out-Contributor lia-component-message-view-widget-author-username"&gt;&lt;A id="link_5" class="lia-link-navigation lia-page-link lia-user-name-link" style="color: #333f48;" href="https://community.nxp.com/t5/user/viewprofilepage/user-id/249735" target="_self" aria-label="View Profile of 薄荷"&gt;&lt;SPAN class=""&gt;薄荷&lt;/SPAN&gt;&lt;/A&gt;&lt;/SPAN&gt;&lt;/P&gt;
&lt;P&gt;Please refer to the" 17 Soldering of SMD packages" in datasheet and the AN10365&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/docs/en/data-sheet/PCF85176.pdf" target="_blank"&gt;https://www.nxp.com/docs/en/data-sheet/PCF85176.pdf&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/docs/en/application-note/AN10365.pdf" target="_blank"&gt;https://www.nxp.com/docs/en/application-note/AN10365.pdf&lt;/A&gt;&lt;/P&gt;</description>
    <pubDate>Thu, 24 Apr 2025 06:27:36 GMT</pubDate>
    <dc:creator>Beckywang</dc:creator>
    <dc:date>2025-04-24T06:27:36Z</dc:date>
    <item>
      <title>PCF85176</title>
      <link>https://community.nxp.com/t5/Other-NXP-Products/PCF85176/m-p/2086222#M28424</link>
      <description>&lt;P&gt;您好，请问贵公司的PCF85176T/1Y 这个芯片在焊接和装配过程中要从哪些方面做好防静电措施？&lt;/P&gt;&lt;P&gt;2.在焊接过程中，建议的焊接温度是多少？焊接的锡膏用量大概是多少？或者说焊接过程中的注意事项？谢谢&lt;/P&gt;</description>
      <pubDate>Thu, 24 Apr 2025 04:52:18 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Other-NXP-Products/PCF85176/m-p/2086222#M28424</guid>
      <dc:creator>薄荷</dc:creator>
      <dc:date>2025-04-24T04:52:18Z</dc:date>
    </item>
    <item>
      <title>Re: PCF85176</title>
      <link>https://community.nxp.com/t5/Other-NXP-Products/PCF85176/m-p/2086271#M28426</link>
      <description>&lt;P&gt;Hello &lt;SPAN class="UserName lia-user-name lia-user-rank-Fresh-Out-Contributor lia-component-message-view-widget-author-username"&gt;&lt;A id="link_5" class="lia-link-navigation lia-page-link lia-user-name-link" style="color: #333f48;" href="https://community.nxp.com/t5/user/viewprofilepage/user-id/249735" target="_self" aria-label="View Profile of 薄荷"&gt;&lt;SPAN class=""&gt;薄荷&lt;/SPAN&gt;&lt;/A&gt;&lt;/SPAN&gt;&lt;/P&gt;
&lt;P&gt;Please refer to the" 17 Soldering of SMD packages" in datasheet and the AN10365&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/docs/en/data-sheet/PCF85176.pdf" target="_blank"&gt;https://www.nxp.com/docs/en/data-sheet/PCF85176.pdf&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/docs/en/application-note/AN10365.pdf" target="_blank"&gt;https://www.nxp.com/docs/en/application-note/AN10365.pdf&lt;/A&gt;&lt;/P&gt;</description>
      <pubDate>Thu, 24 Apr 2025 06:27:36 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Other-NXP-Products/PCF85176/m-p/2086271#M28426</guid>
      <dc:creator>Beckywang</dc:creator>
      <dc:date>2025-04-24T06:27:36Z</dc:date>
    </item>
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