topic Thermal Resistance of Power Amplifier AFLP5G25641 in Other NXP Products

Thermal Resistance of Power Amplifier AFLP5G25641

D_Patel — Tue, 20 Feb 2024 14:57:04 GMT

Hello,

Would anyone happen to know the Junction-to-Case thermal resistance for the 2.5 GHz Low Power Amplifier Module (P/N: AFLP5G25641)? It is not available on the datasheet.

Thanks,

D Patel

Re: Thermal Resistance of Power Amplifier AFLP5G25641

diazmarin09 — Tue, 20 Feb 2024 17:05:10 GMT

Hello D_Patel,

I hope all is great with you. Thank you for using the NXP communities.

The available thermal information of the device is shown below:

I hope this information helps.

Regards,

David

Re: Thermal Resistance of Power Amplifier AFLP5G25641

D_Patel — Tue, 20 Feb 2024 17:10:49 GMT

Hi David,

Thanks for the reply. Unfortunately, I do not see the Junction-to-Case resistance in your screenshot, nor do I see a way to calculate or estimate with the information provided. I imagine there is no additional thermal information available for AFLP5G25641? Any thermal test data?

Thanks,

Deven Patel

Re: Thermal Resistance of Power Amplifier AFLP5G25641

diazmarin09 — Thu, 22 Feb 2024 15:02:12 GMT

Hello D_Patel,

I am pleased to contact you again.

The AFLP5G25641 has 3 stages of amplification (as shown on fig1 of the data sheet).

The qjc of the 3d stage, the hottest one, is 63°C/W.

To clarify, what we refer as case is the bottom of the package, not the top.

I hope this information helps.

Regards,

David