Other NXP ProductsのトピックRe: LS1046A thermal design

LS1046A thermal design

Nareshvarikuntla — Mon, 21 Jun 2021 11:06:38 GMT

Dear NXP,

I would like to have custom made heat sink attached to LS1046A. What is the maximum pressure LS1046A can able to withstand. How much contact pressure LS1046A needed for good thermal design.

I will be happy if you can share other relevant thermal design information.

Regards,

Naresh V.

Re: LS1046A thermal design

andrei_skok — Wed, 23 Jun 2021 14:04:17 GMT

Please look at the LS1046 Datasheet https://www.nxp.com/docs/en/data-sheet/LS1046A.pdf, chapter 6.3 Thermal management information.

Here you can find our recommendations for thermal design.

"The heat sink should be attached to the printed-circuit board with the spring force centered over the die. This spring force should not exceed 15 pounds force (65 N)."

Re: LS1046A thermal design

Nareshvarikuntla — Wed, 23 Jun 2021 14:15:27 GMT

Thanks for the response.