topic When the work around about LPC546xx USB1 (ES_LPC546XX 3.22)will be available in the SDK? in LPC Microcontrollers

When the work around about LPC546xx USB1 (ES_LPC546XX 3.22)will be available in the SDK?

wangyanjun — Mon, 09 Nov 2020 08:33:25 GMT

For LPC546xx errata Rev 2.2, there is an problem about USB1 high speed device data transfers (3.22 USB.15:USB high-speed device in endpoint TX data corruption). A former post said the work around will be available in SDK. I wonder when the solution will be available.

Re: When the work around about LPC546xx USB1 (ES_LPC546XX 3.22)will be available in the SDK?

Alice_Yang — Tue, 10 Nov 2020 08:21:03 GMT

Hello,

The workaround is

A NAKed Tx (IN) transfer in-between the RX (OUT) and TX (IN) transfers solves the issue.

Re: When the work around about LPC546xx USB1 (ES_LPC546XX 3.22)will be available in the SDK?

wangyanjun — Tue, 10 Nov 2020 14:39:05 GMT

This link (https://community.nxp.com/t5/LPC-Microcontrollers/LPC546xx-Errata-3-22/m-p/858489#M34185)said the work around will be available in SDK. Is it available now?

Re: When the work around about LPC546xx USB1 (ES_LPC546XX 3.22)will be available in the SDK?

BenDev — Tue, 11 May 2021 10:04:13 GMT

How do we accomplish the "NAKed Tx (IN) transfer in-between the RX (OUT) and TX (IN) transfers"? Can you please provide some sample code or provide an updated SDK?

Regards,

Ben

Re: When the work around about LPC546xx USB1 (ES_LPC546XX 3.22)will be available in the SDK?

wangyanjun — Wed, 12 May 2021 11:38:26 GMT

I don't know how send NAK, and I modify my host code to send different data length.