Kinetis Microcontrollers中的主题 Re: MKL24Z32VFM4 exposed pad? https://community.nxp.com/t5/Kinetis-Microcontrollers/MKL24Z32VFM4-exposed-pad/m-p/760777#M46377 <HTML><HEAD></HEAD><BODY><P>Hi LARRY,</P><P>The bottom of the package provides the primary heat removal path, as well as excellent electrical grounding to the PCB through an exposed pad (EP).</P><P>Please check the application note <A href="https://www.nxp.com/docs/en/application-note/AN1902.pdf">AN1902</A> for more information.</P><P><span class="lia-inline-image-display-wrapper" image-alt="4.2.2Thermal Electrical Pad Guidelines.jpg"><img src="https://community.nxp.com/t5/image/serverpage/image-id/37501iDF2CB2AA241E899E/image-size/large?v=v2&amp;px=999" role="button" title="4.2.2Thermal Electrical Pad Guidelines.jpg" alt="4.2.2Thermal Electrical Pad Guidelines.jpg" /></span></P><P>Best Regards,</P><P>Robin</P><P style="min- padding: 0px;">&nbsp;</P><P>-----------------------------------------------------------------------------------------------------------------------<BR />Note: If this post answers your question, please click the Correct Answer button. Thank you!<BR />-----------------------------------------------------------------------------------------------------------------------</P></BODY></HTML> Fri, 05 Jan 2018 06:28:40 GMT Robin_Shen 2018-01-05T06:28:40Z MKL24Z32VFM4 exposed pad? https://community.nxp.com/t5/Kinetis-Microcontrollers/MKL24Z32VFM4-exposed-pad/m-p/760776#M46376 <HTML><HEAD></HEAD><BODY><P>MKL24Z32VFM4 is in an unusual package SOT617-17.&nbsp; There's not much info on what electrically, if anything, it should attach to.&nbsp; Package doc calls it "EXPOSED DIE ATTACH PAD".&nbsp; Should it be attached to VSS/VSSA?</P></BODY></HTML> Wed, 03 Jan 2018 16:26:06 GMT https://community.nxp.com/t5/Kinetis-Microcontrollers/MKL24Z32VFM4-exposed-pad/m-p/760776#M46376 larryklotz 2018-01-03T16:26:06Z Re: MKL24Z32VFM4 exposed pad? https://community.nxp.com/t5/Kinetis-Microcontrollers/MKL24Z32VFM4-exposed-pad/m-p/760777#M46377 <HTML><HEAD></HEAD><BODY><P>Hi LARRY,</P><P>The bottom of the package provides the primary heat removal path, as well as excellent electrical grounding to the PCB through an exposed pad (EP).</P><P>Please check the application note <A href="https://www.nxp.com/docs/en/application-note/AN1902.pdf">AN1902</A> for more information.</P><P><span class="lia-inline-image-display-wrapper" image-alt="4.2.2Thermal Electrical Pad Guidelines.jpg"><img src="https://community.nxp.com/t5/image/serverpage/image-id/37501iDF2CB2AA241E899E/image-size/large?v=v2&amp;px=999" role="button" title="4.2.2Thermal Electrical Pad Guidelines.jpg" alt="4.2.2Thermal Electrical Pad Guidelines.jpg" /></span></P><P>Best Regards,</P><P>Robin</P><P style="min- padding: 0px;">&nbsp;</P><P>-----------------------------------------------------------------------------------------------------------------------<BR />Note: If this post answers your question, please click the Correct Answer button. Thank you!<BR />-----------------------------------------------------------------------------------------------------------------------</P></BODY></HTML> Fri, 05 Jan 2018 06:28:40 GMT https://community.nxp.com/t5/Kinetis-Microcontrollers/MKL24Z32VFM4-exposed-pad/m-p/760777#M46377 Robin_Shen 2018-01-05T06:28:40Z Re: MKL24Z32VFM4 exposed pad? https://community.nxp.com/t5/Kinetis-Microcontrollers/MKL24Z32VFM4-exposed-pad/m-p/760778#M46378 <HTML><HEAD></HEAD><BODY><P>Thanks Robin.&nbsp; This statement in Sec. 4.2.2 is the only place anywhere that states connecting the pad to circuit ground.</P><P>LK</P></BODY></HTML> Thu, 11 Jan 2018 20:33:31 GMT https://community.nxp.com/t5/Kinetis-Microcontrollers/MKL24Z32VFM4-exposed-pad/m-p/760778#M46378 larryklotz 2018-01-11T20:33:31Z