topic i.MX8MP Heat Spreader Solution in i.MX Processors

i.MX8MP Heat Spreader Solution

Wobaffet — Fri, 31 Jul 2026 13:14:47 GMT

We are considering the following passive thermal solution for our i.MX 8M Plus–based infotainment application:

Aluminum heat spreader: 20 × 20 × 1.5 mm (up to 30 × 30 × 2 mm)

TIM: Henkel Bergquist Gap Filler TGF 2000

The aluminum plate will be used as a heat spreader on top of the i.MX 8M Plus.

Would this solution be sufficient for a typical infotainment workload? If not, could you recommend the appropriate heat-spreader size or any additional thermal requirements?

Re: i.MX8MP Heat Spreader Solution

Chavira — Fri, 31 Jul 2026 17:31:35 GMT

Hi @Wobaffet,
Thank you for contacting NXP Support!

For this purpose, I recommend reviewing the i.MX8MP Hardware Design Guide, specifically Chapter 7.8, "Heat Sink Considerations", which provides detailed information and design recommendations for thermal management and heat sink implementation on the i.MX8MP.

This chapter covers the key requirements and considerations needed to ensure proper thermal performance and reliable operation of the device.

Best regards,
Chavira