Ball Diameter for i.MX 6ULL LFBGA289 Package

a1wolfe — Wed, 04 Feb 2026 14:04:18 GMT

Can anyone confirm the ball diameter or a recommended pad diameter for the LFBGA289 package found here?
SOT1534-2: LFBGA289 | NXP Semiconductors

The drawing show 0.45mm over 0.35mm, is this the possible range or two different nominal values?

The nominal footprint I downloaded from NXP uses 0.37mm pad diameters, while the reference design MCIMX6ULL-CM uses 0.30mm pad diameters.

I am designing with MCIMX6Y2DVM09AB specifically.

I started a chat on the website and attached the transcript. I received confirmation that the ball diameter is actually in the range of 0.38 to 0.48mm. Is this accurate and the drawing is not up to date? They also mentioned a document with recommended land patterns that could potentially be shared, and recommended a pad diameter of 0.4mm. That seems high to me, given the reference SODIMM module uses about 0.3mm

Re: Ball Diameter for i.MX 6ULL LFBGA289 Package

JorgeCas — Thu, 05 Feb 2026 16:40:09 GMT

Hello,

The drawing show 0.45mm over 0.35mm, is this the possible range or two different nominal values?

These values are a possible range of ball diameter.

Is this accurate and the drawing is not up to date?

All of the dimensions (documentation, footprint, design files) can be “correct” according to the different land‑pattern for your design such as NSMD or SMD, I suggest you use the footprint provided in NXP website. As you mention, the reference design can use a smaller pad diameter but at the end, this can vary depending on the specific manufacturing process.

Best regards.

topic Re: Ball Diameter for i.MX 6ULL LFBGA289 Package in i.MX Processors

Ball Diameter for i.MX 6ULL LFBGA289 Package

Re: Ball Diameter for i.MX 6ULL LFBGA289 Package