<?xml version="1.0" encoding="UTF-8"?>
<rss xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:taxo="http://purl.org/rss/1.0/modules/taxonomy/" version="2.0">
  <channel>
    <title>topic Re: Maximum force for applying heatsink in i.MX Processors</title>
    <link>https://community.nxp.com/t5/i-MX-Processors/Maximum-force-for-applying-heatsink/m-p/2099742#M237329</link>
    <description>&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;From the Table 5 in AN4871, the average pressure on the FCBGA package is around 0.03 lb/mm2.&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;&lt;SPAN&gt;The max force for&amp;nbsp;i.MX8M Mini/nano in&amp;nbsp;FCBGA486 package 14x14mm is &lt;/SPAN&gt;&lt;SPAN&gt;5&lt;/SPAN&gt;&lt;SPAN&gt; lbs(0.03 x 14 x 14).&lt;/SPAN&gt;&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;&lt;SPAN&gt;i.MX8M Plus in&amp;nbsp;F&lt;/SPAN&gt;&lt;SPAN&gt;C&lt;/SPAN&gt;&lt;SPAN&gt;BGA548 package, 15 x 15 mm, is around 6lbs(0.03 x 1&lt;/SPAN&gt;&lt;SPAN&gt;5&lt;/SPAN&gt;&lt;SPAN&gt; x 1&lt;/SPAN&gt;&lt;SPAN&gt;5&lt;/SPAN&gt;&lt;SPAN&gt;).&lt;/SPAN&gt;&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;&lt;SPAN&gt;For the PMIC parameters, please create case in the &lt;/SPAN&gt;&lt;A href="https://community.nxp.com/t5/Power-Management/bd-p/Power-Management" target="_blank"&gt;&lt;SPAN&gt;https://community.nxp.com/t5/Power-Management/bd-p/Power-Management&lt;/SPAN&gt;&lt;/A&gt;&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;" lang="en-US"&gt;Thanks&lt;/P&gt;</description>
    <pubDate>Mon, 19 May 2025 09:22:54 GMT</pubDate>
    <dc:creator>June_Lu</dc:creator>
    <dc:date>2025-05-19T09:22:54Z</dc:date>
    <item>
      <title>Maximum force for applying heatsink</title>
      <link>https://community.nxp.com/t5/i-MX-Processors/Maximum-force-for-applying-heatsink/m-p/2098663#M237280</link>
      <description>&lt;P&gt;What is the maximum force for the following components:&lt;/P&gt;&lt;P&gt;i.MX8M Mini/nano in&amp;nbsp;FCPBGA486 package&lt;/P&gt;&lt;P&gt;i.MX8M Plus in&amp;nbsp;LFBGA548 package&lt;/P&gt;&lt;P&gt;PMIC:&amp;nbsp; PCA9450CHNY &amp;amp;&amp;nbsp;PCA9450AAHNY:&amp;nbsp; 56 HVQFN&amp;nbsp; package&amp;nbsp;&lt;/P&gt;</description>
      <pubDate>Fri, 16 May 2025 06:20:36 GMT</pubDate>
      <guid>https://community.nxp.com/t5/i-MX-Processors/Maximum-force-for-applying-heatsink/m-p/2098663#M237280</guid>
      <dc:creator>jeroenvanandel</dc:creator>
      <dc:date>2025-05-16T06:20:36Z</dc:date>
    </item>
    <item>
      <title>Re: Maximum force for applying heatsink</title>
      <link>https://community.nxp.com/t5/i-MX-Processors/Maximum-force-for-applying-heatsink/m-p/2099742#M237329</link>
      <description>&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;From the Table 5 in AN4871, the average pressure on the FCBGA package is around 0.03 lb/mm2.&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;&lt;SPAN&gt;The max force for&amp;nbsp;i.MX8M Mini/nano in&amp;nbsp;FCBGA486 package 14x14mm is &lt;/SPAN&gt;&lt;SPAN&gt;5&lt;/SPAN&gt;&lt;SPAN&gt; lbs(0.03 x 14 x 14).&lt;/SPAN&gt;&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;&lt;SPAN&gt;i.MX8M Plus in&amp;nbsp;F&lt;/SPAN&gt;&lt;SPAN&gt;C&lt;/SPAN&gt;&lt;SPAN&gt;BGA548 package, 15 x 15 mm, is around 6lbs(0.03 x 1&lt;/SPAN&gt;&lt;SPAN&gt;5&lt;/SPAN&gt;&lt;SPAN&gt; x 1&lt;/SPAN&gt;&lt;SPAN&gt;5&lt;/SPAN&gt;&lt;SPAN&gt;).&lt;/SPAN&gt;&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;"&gt;&lt;SPAN&gt;For the PMIC parameters, please create case in the &lt;/SPAN&gt;&lt;A href="https://community.nxp.com/t5/Power-Management/bd-p/Power-Management" target="_blank"&gt;&lt;SPAN&gt;https://community.nxp.com/t5/Power-Management/bd-p/Power-Management&lt;/SPAN&gt;&lt;/A&gt;&lt;/P&gt;
&lt;P style="margin: 0in; font-family: Calibri; font-size: 11.0pt;" lang="en-US"&gt;Thanks&lt;/P&gt;</description>
      <pubDate>Mon, 19 May 2025 09:22:54 GMT</pubDate>
      <guid>https://community.nxp.com/t5/i-MX-Processors/Maximum-force-for-applying-heatsink/m-p/2099742#M237329</guid>
      <dc:creator>June_Lu</dc:creator>
      <dc:date>2025-05-19T09:22:54Z</dc:date>
    </item>
  </channel>
</rss>

