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    <title>i.MX ProcessorsのトピックRe: iMX6 PCB manufacturing method</title>
    <link>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782421#M121466</link>
    <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Hello gusarambula,&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;I appreciate your support. I've checked both gerber data.&lt;/P&gt;&lt;P&gt;I believe both boards are build by through-hole method. because, all vias located on same position at all layer.&lt;/P&gt;&lt;P&gt;But, I could not find any comments into any documents.&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;Best Regards,&lt;/P&gt;&lt;P&gt;Kazuma Sasaki.&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
    <pubDate>Sun, 29 Jul 2018 23:54:07 GMT</pubDate>
    <dc:creator>Kazuma_Sasaki</dc:creator>
    <dc:date>2018-07-29T23:54:07Z</dc:date>
    <item>
      <title>iMX6 PCB manufacturing method</title>
      <link>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782419#M121464</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;I would like to confirm manufacturing method of SABRE-AI and SDB boards.&lt;/P&gt;&lt;P&gt;I guess these boards made by build-up method. Is it right?&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;Best Regards,&lt;/P&gt;&lt;P&gt;Kazuma Sasaki.&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Wed, 25 Jul 2018 11:53:39 GMT</pubDate>
      <guid>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782419#M121464</guid>
      <dc:creator>Kazuma_Sasaki</dc:creator>
      <dc:date>2018-07-25T11:53:39Z</dc:date>
    </item>
    <item>
      <title>Re: iMX6 PCB manufacturing method</title>
      <link>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782420#M121465</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Hello Kazuma Sasaki,&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;I think the SBD boards are through-hole and not build-up, but let me confirm for the SDB and also SABRE-AI and I’ll let you know.&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;Regards,&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Fri, 27 Jul 2018 20:31:58 GMT</pubDate>
      <guid>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782420#M121465</guid>
      <dc:creator>gusarambula</dc:creator>
      <dc:date>2018-07-27T20:31:58Z</dc:date>
    </item>
    <item>
      <title>Re: iMX6 PCB manufacturing method</title>
      <link>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782421#M121466</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Hello gusarambula,&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;I appreciate your support. I've checked both gerber data.&lt;/P&gt;&lt;P&gt;I believe both boards are build by through-hole method. because, all vias located on same position at all layer.&lt;/P&gt;&lt;P&gt;But, I could not find any comments into any documents.&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;Best Regards,&lt;/P&gt;&lt;P&gt;Kazuma Sasaki.&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Sun, 29 Jul 2018 23:54:07 GMT</pubDate>
      <guid>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782421#M121466</guid>
      <dc:creator>Kazuma_Sasaki</dc:creator>
      <dc:date>2018-07-29T23:54:07Z</dc:date>
    </item>
    <item>
      <title>Re: iMX6 PCB manufacturing method</title>
      <link>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782422#M121467</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Hello Kazuma Sasaki,&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;While it’s not mentioned on the documentation both the SABRE-SDB and the SABRE-AI boards don’t use build-up vias as they make the manufacture more costly and not all manufacturers can do build-up vidas. They both use&amp;nbsp;through-hole.&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;I hope this information helps,&lt;/P&gt;&lt;P&gt;Regards,&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Tue, 31 Jul 2018 20:12:59 GMT</pubDate>
      <guid>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782422#M121467</guid>
      <dc:creator>gusarambula</dc:creator>
      <dc:date>2018-07-31T20:12:59Z</dc:date>
    </item>
    <item>
      <title>Re: iMX6 PCB manufacturing method</title>
      <link>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782423#M121468</link>
      <description>&lt;HTML&gt;&lt;HEAD&gt;&lt;/HEAD&gt;&lt;BODY&gt;&lt;P&gt;Hello gusarambula,&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;Thank you for your answer. I understood clearly.&lt;/P&gt;&lt;P&gt;&lt;/P&gt;&lt;P&gt;Best Regards,&lt;/P&gt;&lt;P&gt;Kazuma Sasaki.&lt;/P&gt;&lt;/BODY&gt;&lt;/HTML&gt;</description>
      <pubDate>Mon, 06 Aug 2018 07:59:08 GMT</pubDate>
      <guid>https://community.nxp.com/t5/i-MX-Processors/iMX6-PCB-manufacturing-method/m-p/782423#M121468</guid>
      <dc:creator>Kazuma_Sasaki</dc:creator>
      <dc:date>2018-08-06T07:59:08Z</dc:date>
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