PCA85133U/2DA/Q1Z

ppnachi — Wed, 12 Mar 2025 02:01:56 GMT

Hi,

My Segment LCDs are in production from China. To choose a driver IC for the LCDs, I found a NXP part number PCA85133U/2DA/Q1Z.

This is a bare die chip. According to the datasheet it says this chip is compatible for COG fabrication. But for my application, I'm looking for a COB bare die chip.

My question is does the above mentioned part number will support for the COB fabrication? If yes I want to buy bulk quantity.

Waiting for your reply and advise

Rgds

Nazar PP

Re: PCA85133U/2DA/Q1Z

TomasVaverka — Wed, 12 Mar 2025 09:09:55 GMT

Hi,

The PCA85133U/2DA/Q1Z is a bare die chip optimized for anisotropic conductive film (ACF) bonding.

As the COB fabrication typically requires a packaged IC or a bare die with suitable wire bonding and encapsulation support for mounting on a PCB, the PCA85133U/2DA/Q1Z is not suitable for that.

BRs, Tomas

topic Re: PCA85133U/2DA/Q1Z in High Performance Analog Front End Interfaces

PCA85133U/2DA/Q1Z

Re: PCA85133U/2DA/Q1Z