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    <title>topic Re: PCA9450AHN Assembly guidelines issue in Power Management</title>
    <link>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1835170#M3393</link>
    <description>&lt;P&gt;I searched but no result for the heat sink related information for this HVQFN package.&lt;/P&gt;
&lt;P&gt;We have the heat sink force spec on CSP package only.&lt;/P&gt;</description>
    <pubDate>Wed, 27 Mar 2024 00:32:14 GMT</pubDate>
    <dc:creator>guoweisun</dc:creator>
    <dc:date>2024-03-27T00:32:14Z</dc:date>
    <item>
      <title>PCA9450AHN Assembly guidelines issue</title>
      <link>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1832527#M3378</link>
      <description>&lt;P&gt;we want to put heat-sink on the surface of the PMIC, do we have some guide for the limit pressure of the surface information&lt;/P&gt;</description>
      <pubDate>Thu, 21 Mar 2024 03:13:16 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1832527#M3378</guid>
      <dc:creator>JoeyQu</dc:creator>
      <dc:date>2024-03-21T03:13:16Z</dc:date>
    </item>
    <item>
      <title>Re: PCA9450AHN Assembly guidelines issue</title>
      <link>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1832532#M3379</link>
      <description>&lt;P&gt;Hi&amp;nbsp;&lt;/P&gt;
&lt;P&gt;No need for mount the heat sink on PCA9450,4-6 layers PCB can handle its power dissipation.&lt;/P&gt;</description>
      <pubDate>Thu, 21 Mar 2024 03:16:43 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1832532#M3379</guid>
      <dc:creator>guoweisun</dc:creator>
      <dc:date>2024-03-21T03:16:43Z</dc:date>
    </item>
    <item>
      <title>Re: PCA9450AHN Assembly guidelines issue</title>
      <link>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1835127#M3392</link>
      <description>&lt;P&gt;But the truth is , it put very near to the processor. so the team need to put&amp;nbsp;&lt;SPAN class=""&gt;Cooling on the whole area(CPU+PMIC+DDR..), so we need to consider the PMIC limit force of it. could you offer the related document?&lt;/SPAN&gt;&lt;/P&gt;</description>
      <pubDate>Tue, 26 Mar 2024 05:55:53 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1835127#M3392</guid>
      <dc:creator>JoeyQu</dc:creator>
      <dc:date>2024-03-26T05:55:53Z</dc:date>
    </item>
    <item>
      <title>Re: PCA9450AHN Assembly guidelines issue</title>
      <link>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1835170#M3393</link>
      <description>&lt;P&gt;I searched but no result for the heat sink related information for this HVQFN package.&lt;/P&gt;
&lt;P&gt;We have the heat sink force spec on CSP package only.&lt;/P&gt;</description>
      <pubDate>Wed, 27 Mar 2024 00:32:14 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Power-Management/PCA9450AHN-Assembly-guidelines-issue/m-p/1835170#M3393</guid>
      <dc:creator>guoweisun</dc:creator>
      <dc:date>2024-03-27T00:32:14Z</dc:date>
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