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    <title>Layerscape中的主题 LS1012A packing spec</title>
    <link>https://community.nxp.com/t5/Layerscape/LS1012A-packing-spec/m-p/1758037#M13662</link>
    <description>&lt;P&gt;Hi,&lt;/P&gt;&lt;P&gt;How to get LS1012A packing information?&lt;/P&gt;&lt;P&gt;tape reel / tray spec description&lt;/P&gt;&lt;P&gt;the pin 1 orientation in tape reel or tray&lt;/P&gt;&lt;P&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;thanks&lt;/P&gt;</description>
    <pubDate>Thu, 16 Nov 2023 03:47:30 GMT</pubDate>
    <dc:creator>SHOESLEU</dc:creator>
    <dc:date>2023-11-16T03:47:30Z</dc:date>
    <item>
      <title>LS1012A packing spec</title>
      <link>https://community.nxp.com/t5/Layerscape/LS1012A-packing-spec/m-p/1758037#M13662</link>
      <description>&lt;P&gt;Hi,&lt;/P&gt;&lt;P&gt;How to get LS1012A packing information?&lt;/P&gt;&lt;P&gt;tape reel / tray spec description&lt;/P&gt;&lt;P&gt;the pin 1 orientation in tape reel or tray&lt;/P&gt;&lt;P&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;thanks&lt;/P&gt;</description>
      <pubDate>Thu, 16 Nov 2023 03:47:30 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Layerscape/LS1012A-packing-spec/m-p/1758037#M13662</guid>
      <dc:creator>SHOESLEU</dc:creator>
      <dc:date>2023-11-16T03:47:30Z</dc:date>
    </item>
    <item>
      <title>Re: LS1012A packing spec</title>
      <link>https://community.nxp.com/t5/Layerscape/LS1012A-packing-spec/m-p/1763213#M13689</link>
      <description>&lt;P&gt;The &lt;FONT class="&amp;amp;quothighlight&amp;quot;"&gt;&lt;STRONG&gt;LS1012A&lt;/STRONG&gt;&lt;/FONT&gt; device package type is 9.6 mm x 9.6 mm molded FC-LGA.&lt;/P&gt;
&lt;P&gt;The package parameters are as follows: Package 9.6 mm x 9.6 mm molded FC-LGA Pitch 0.5 mm Solder Alloy composition SAC 305 (96.5/3.0/0.5)&lt;/P&gt;
&lt;P&gt;Please refer to the application note "Assembly Guidelines for Land Grid Array (LGA) Package": &lt;A href="https://www.nxp.com/docs/en/application-note/AN2265.pdf" target="_blank"&gt;https://www.nxp.com/docs/en/application-note/AN2265.pdf&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;&amp;nbsp;&lt;/P&gt;
&lt;P&gt;Please refer to the following link:&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/products/processors-and-microcontrollers/arm-based-processors-and-mcus/qoriq-layerscape-arm-processors/qoriq-layerscape-1012a-low-power-communication-processor:LS1012A?tab=Buy_Parametric_Tab&amp;amp;lang_cd=en#LS1012AXE7KKB" target="_blank"&gt;https://www.nxp.com/products/processors-and-microcontrollers/arm-based-processors-and-mcus/qoriq-layerscape-arm-processors/qoriq-layerscape-1012a-low-power-communication-processor:LS1012A?tab=Buy_Parametric_Tab&amp;amp;lang_cd=en#LS1012AXE7KKB&amp;nbsp;&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;Mounting technique is described in the application note AN5310: &lt;A href="https://www.nxp.com/webapp/Download?colCode=AN5310" target="_blank"&gt;https://www.nxp.com/webapp/Download?colCode=AN5310&lt;/A&gt; &amp;nbsp;&lt;/P&gt;
&lt;P&gt;&lt;FONT class="&amp;amp;quothighlight&amp;quot;"&gt;&lt;STRONG&gt;LS1012A&lt;/STRONG&gt;&lt;/FONT&gt; part marking is provided in the QorIQ &lt;FONT class="&amp;amp;quothighlight&amp;quot;"&gt;&lt;STRONG&gt;LS1012A&lt;/STRONG&gt;&lt;/FONT&gt; Data Sheet, 8.2 Part marking.&lt;/P&gt;
&lt;P&gt;&amp;nbsp;&lt;/P&gt;</description>
      <pubDate>Fri, 24 Nov 2023 08:52:08 GMT</pubDate>
      <guid>https://community.nxp.com/t5/Layerscape/LS1012A-packing-spec/m-p/1763213#M13689</guid>
      <dc:creator>yipingwang</dc:creator>
      <dc:date>2023-11-24T08:52:08Z</dc:date>
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