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    <title>topic Re: MC9S08AC32  Baking temperature, Soldering information in 8-bit Microcontrollers</title>
    <link>https://community.nxp.com/t5/8-bit-Microcontrollers/MC9S08AC32-Baking-temperature-Soldering-information/m-p/1606417#M23672</link>
    <description>&lt;P&gt;if you check the following link you can find all the package options for the S08AC devices,&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/products/processors-and-microcontrollers/additional-mpu-mcus-architectures/8-bit-s08-mcus/8-bit-flexis-ac128-96-60-48-32-mcus:S08AC?tab=Package_Quality_Tab" target="_blank"&gt;https://www.nxp.com/products/processors-and-microcontrollers/additional-mpu-mcus-architectures/8-bit-s08-mcus/8-bit-flexis-ac128-96-60-48-32-mcus:S08AC?tab=Package_Quality_Tab&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;all of them are lead free I will take just as an example the&amp;nbsp;&lt;A href="https://www.nxp.com/part/MC9S08AC8MFGE" target="_blank" rel="noopener" data-dtmsubaction="MC9S08AC8MFGE" data-dtmid="MC9S08AC8MFGE"&gt;MC9S08AC8MFGE&lt;/A&gt;&amp;nbsp;that is a LQFP 44&lt;/P&gt;
&lt;P&gt;on this link you will see that the peak of temperature is 260 C and this device is MLS 3&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/part/MC9S08AC8MFGE#/" target="_blank"&gt;https://www.nxp.com/part/MC9S08AC8MFGE#/&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;so for the soldering we have the followin application note&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/docs/en/application-note/AN3300.pdf" target="_blank"&gt;https://www.nxp.com/docs/en/application-note/AN3300.pdf&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;&amp;nbsp;&lt;/P&gt;
&lt;P&gt;Regarding to baking you need to follow the&amp;nbsp;&lt;/P&gt;
&lt;P&gt;&lt;SPAN&gt;IPC/JEDEC J-STD-033 Bake Conditions&lt;/SPAN&gt;&lt;/P&gt;
&lt;P&gt;and depending the package that you are using is the time and the temperature that you need to use&lt;/P&gt;
&lt;P&gt;&amp;nbsp;&lt;/P&gt;</description>
    <pubDate>Mon, 27 Feb 2023 23:39:27 GMT</pubDate>
    <dc:creator>vicentegomez</dc:creator>
    <dc:date>2023-02-27T23:39:27Z</dc:date>
    <item>
      <title>MC9S08AC32  Baking temperature, Soldering information</title>
      <link>https://community.nxp.com/t5/8-bit-Microcontrollers/MC9S08AC32-Baking-temperature-Soldering-information/m-p/1605714#M23670</link>
      <description>&lt;P&gt;Hi Would you kindly help to provide the&amp;nbsp;MC9S08AC32 Baking temperature, Soldering information,thanks&lt;/P&gt;</description>
      <pubDate>Mon, 27 Feb 2023 03:18:14 GMT</pubDate>
      <guid>https://community.nxp.com/t5/8-bit-Microcontrollers/MC9S08AC32-Baking-temperature-Soldering-information/m-p/1605714#M23670</guid>
      <dc:creator>caesar_song</dc:creator>
      <dc:date>2023-02-27T03:18:14Z</dc:date>
    </item>
    <item>
      <title>Re: MC9S08AC32  Baking temperature, Soldering information</title>
      <link>https://community.nxp.com/t5/8-bit-Microcontrollers/MC9S08AC32-Baking-temperature-Soldering-information/m-p/1606417#M23672</link>
      <description>&lt;P&gt;if you check the following link you can find all the package options for the S08AC devices,&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/products/processors-and-microcontrollers/additional-mpu-mcus-architectures/8-bit-s08-mcus/8-bit-flexis-ac128-96-60-48-32-mcus:S08AC?tab=Package_Quality_Tab" target="_blank"&gt;https://www.nxp.com/products/processors-and-microcontrollers/additional-mpu-mcus-architectures/8-bit-s08-mcus/8-bit-flexis-ac128-96-60-48-32-mcus:S08AC?tab=Package_Quality_Tab&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;all of them are lead free I will take just as an example the&amp;nbsp;&lt;A href="https://www.nxp.com/part/MC9S08AC8MFGE" target="_blank" rel="noopener" data-dtmsubaction="MC9S08AC8MFGE" data-dtmid="MC9S08AC8MFGE"&gt;MC9S08AC8MFGE&lt;/A&gt;&amp;nbsp;that is a LQFP 44&lt;/P&gt;
&lt;P&gt;on this link you will see that the peak of temperature is 260 C and this device is MLS 3&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/part/MC9S08AC8MFGE#/" target="_blank"&gt;https://www.nxp.com/part/MC9S08AC8MFGE#/&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;so for the soldering we have the followin application note&lt;/P&gt;
&lt;P&gt;&lt;A href="https://www.nxp.com/docs/en/application-note/AN3300.pdf" target="_blank"&gt;https://www.nxp.com/docs/en/application-note/AN3300.pdf&lt;/A&gt;&lt;/P&gt;
&lt;P&gt;&amp;nbsp;&lt;/P&gt;
&lt;P&gt;Regarding to baking you need to follow the&amp;nbsp;&lt;/P&gt;
&lt;P&gt;&lt;SPAN&gt;IPC/JEDEC J-STD-033 Bake Conditions&lt;/SPAN&gt;&lt;/P&gt;
&lt;P&gt;and depending the package that you are using is the time and the temperature that you need to use&lt;/P&gt;
&lt;P&gt;&amp;nbsp;&lt;/P&gt;</description>
      <pubDate>Mon, 27 Feb 2023 23:39:27 GMT</pubDate>
      <guid>https://community.nxp.com/t5/8-bit-Microcontrollers/MC9S08AC32-Baking-temperature-Soldering-information/m-p/1606417#M23672</guid>
      <dc:creator>vicentegomez</dc:creator>
      <dc:date>2023-02-27T23:39:27Z</dc:date>
    </item>
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