Seeking patch process instructions. chips are not easy to be tinned and can't work

chengtianquan — Tue, 14 Jan 2020 05:44:55 GMT

Dear NXP,

Our Car TPMS project uses NXP products, a total of 4 ICs，FXTH87EH11DT1 (tire pressure sensor, HQFN24 package), QN9020 / EY (Bluetooth LE, HVQFN48 package), QN9021 / EY (Bluetooth LE, HVQFN32 package), NCK2910AHN (RF receiver, HVQFN32 package).
For the packaging of related chips, our chip has encountered soldering problems, that is, poor solder contact of the chip. As a result, some chips cannot work, or only work for a period of time. We need to seek your support to improve our placement process.
For the four chip packages mentioned above, does NXP have a placement process description document?

Looking forward to your reply.

Thank you.

Best Regards

Owen

Re: Seeking patch process instructions. chips are not easy to be tinned and can't work

vicentegomez — Tue, 21 Jan 2020 16:58:11 GMT

We have some solder recommendations on the following documents,

https://www.nxp.com/docs/en/application-note/AN1902.pdf

https://www.nxp.com/docs/en/nxp/application-notes/AN11996.pdf

Also please check the solder profile and the solder paste that you are using.

Please let me know your comments of if you have more questions

Regards

topic Seeking patch process instructions. chips are not easy to be tinned and can't work in 8-bit Microcontrollers

Seeking patch process instructions. chips are not easy to be tinned and can't work

Re: Seeking patch process instructions. chips are not easy to be tinned and can't work