i.MX6ull Change DDR3 from 512 Mb to 1Gb

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i.MX6ull Change DDR3 from 512 Mb to 1Gb

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analogicstechin
Contributor III

Dear Team,

 In our custom board i.MX6ull Changed DDR3 from 512 Mb to 1Gb ,facing the issue in DDR stress  test failed. we used ISSI part IS43TR16512BL-125KBL (attached datasheet),kindly resolve the problem.

below log will give the clear information:

============================================
DDR Stress Test (2.9.2)
Build: Sep 17 2018, 23:08:48
NXP Semiconductors.
============================================

============================================
Chip ID
CHIP ID = i.MX6 UltraLiteLite(0x65)
Internal Revision = TO1.1
============================================

============================================
Boot Configuration
SRC_SBMR1(0x020d8004) = 0x00000052
SRC_SBMR2(0x020d801c) = 0x01000001
============================================

ARM Clock set to 528MHz

============================================
DDR configuration
DDR type is DDR3
Data width: 16, bank num: 8
Row size: 16, col size: 10
Chip select CSD0 is used
Density per chip select: 1024MB
============================================


DDR Stress Test Iteration 1
Current Temperature: 46
============================================

DDR Freq: 396 MHz
t0.1: data is addr test
t0: memcpy11 SSN test
t1: memcpy8 SSN test
t2: byte-wise SSN test
t3: memcpy11 random pattern test
t4: IRAM_to_DDRv2 test
t5: IRAM_to_DDRv1 test
t6: read noise walking ones and zeros test

DDR Freq: 413 MHz
t0.1: data is addr test
t0: memcpy11 SSN test
Address of bank1 failure: 0x88270100
Data initally read was: 0x0100
Data re-read is: 0x0100
But pattern was: 0xffff
Error: failed to run stress test!!!

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igorpadykov
NXP Employee
NXP Employee

Hi Analogics Tech India Limited

from log:

"Data initally read was: 0x0100
Data re-read is: 0x0100
But pattern was: 0xffff "

ddr test write/read pattern 0xffff and expected to read it back.

But instead it read 0x0100 which is error.

One can try to write/read pattern 0xffff with jtag checking data with

oscilloscope. Probably there are errors in ddr layout or poor soldering

Use as help Hardware Development Guide for the i.MX 6UltraLite Applications Processor
https://www.nxp.com/docs/en/user-guide/IMX6ULLHDG.pdf

Best regards
igor
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analogicstechin
Contributor III

Hi igorpadykov,

Thanks for the replay,  here not suspecting ddr layout or poor soldering why because same design working with dual die 512x16 1GB DDR(A0-A14),

comes to single chip 512x16 1GB DDR(A0-A15) error occurred on ddr stress tool,suspecting reason may be drive strength or  system ODT,can please check chip ( IS43TR16512BL-125KBL ) ODT has to be disable or not, how worth it is.

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igorpadykov
NXP Employee
NXP Employee

Hi Analogics Tech India Limited

please use i.MX6DQSDL DDR3 Script Aid 

i.MX6ULL_LPDDR2_Script_Aid 

Best regards
igor

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analogicstechin
Contributor III

Hi igor,

Thanks for the link.

in IS43TR16512Bl-KBL System ODT has disabled.now stress tool working & functionality  working also fine, is this correct way i am  approach!!!!!!!!!.

pastedImage_1.png

please give me clear information.

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igorpadykov
NXP Employee
NXP Employee

Hi Analogics Tech India Limited

please use i.MX6DQSDL DDR3 Script Aid,

it sets all necessary configurations including ODT settings.

Correct approach would be to make ibis modelling and then check if with ODT

it has better waveforms than without it.

Best regards
igor

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