NXP Connects - China - September 5-6, 2018

Document created by Renee Fortenberry Employee on Aug 29, 2018Last modified by Renee Fortenberry Employee on Sep 6, 2018
Version 3Show Document
  • View in full screen mode

Automotive

MCU: MagniV® Integrated Solution Deep Dive 

CAN in Future Car Networks—Understanding the Different Trends and Solutions 

NXP’s xEV Energy Management Solutions 

Building Your Automotive Network with Time-Sensitive Networking (TSN) and Ethernet 

NXP Car Access—Roadmap Towards Smart Access (NFC, BLE, UWB, SE) 

OTA Updates—Requirements for a Full System Solution 

Next-Generation Functional Safety Architecture 

The Rise and Evolution of Automotive Gateways 

Exploring the Automotive General-Purpose MCU Portfolio 

Electrification—HV EV Power Inverter System and GD3100 Review 

Electrification—MC3377x Battery Cell Controllers for High-Voltage Battery Management System 

xEV HV Traction Motor Power Inverter Platform 

Power Management Solutions for Automotive_Connects China 

Next-Generation Automotive Security Solutions Over Automotive Microprocessor 

S32 Common Chassis Overview 

AD/ADAS Overview 

Acceleration on Automitve Radar Signal Processing 

GPIS Touch Sense Solution 

S32 Radar Processor, Product Revolution 

 

Artificial Intelligence, Enabling Technologies, Security & Solutions

Computing at the Edge - When, Why and How_Connects China 

Boot in Less Than One Second? Learn How_Connects China 

A Vision for Machine Learning (ML) and Artificial Intelligence (AI) in Low-Cost Edge-Computing Nodes 

EdgeScale: A Solution for Secure Edge Device and Application Management from the Cloud_Connects China 

Using OpenWRT, Yocto, Ubuntu or Your Own Custom Linux® Distribution? Learn How NXP is Making it Easy to Leverage a Multi-Distribution Approach to Software Development_Connects China 

Overview of i.MX/MCU Security Features 

Learn to Get Up and Running Fast with MCUXpresso Software and Tools 

 

Smart Machinery & Industrial Automation

Time-Sensitive Networking (TSN) and Precision Time Protocol (PTP): Challenges, Opportunities and Solutions 

Open Industrial Linux® (OpenIL)—Secure, Robust, Real-Time for Industrial and Automation Applications_Connects China 

NXP Complete Motor Control Solutions 

 

Multimedia Experience

NXP MCU and MPU Based Voice and Audio Solutions for AI-IoT Market 

 

Smart Networks & Computing

SD-WAN—Concept and Application to Enable Flexible Network Bandwidth Management On-Demand 

SD-CPE—A CPE to be Deployed with VM (Docker, etc.) and Managed by Orchestrator 

DAS and Small Cell for the Mobile Broadband 

High Power RF Applications for Cellular Band with LDMOS Technology 

High Power RF Applications for Above 1GHz Cellular Band with GaN Technology 

 

Smarter World Solutions & Multimode Connectivity

Rapid IoT Prototyping Kit_Connects China 

MiGLO®_Connects China 

NTAG® SmartSensor_Connects China 

Smart Amp Software_Connects China 

Type-C End-to-End Solution_Connect China 

Using Sensors for Low-Power IoT Applications: Tips and Tricks_Connects China 

i.MX RT Overview and Security on Memory Expansion Design 

NXP Connectivity Solutions for Smart Home, Building and Lighting and  BLE Low-Power Solutions for Consumer, Medical, Industrial IoT and Automotive Markets 

Introduction to NXP Wireless Charging Solution and Design 

i.MX RT Enablements and Reference Solutions 

Power Regulation/Market Trend and Overview of NXP AC/DC Power Solutions 

Fast Charger/Adapter (TEA1936+ TEA199x+ TEA1903x/05x); LLC Resonant AC/DC Power (TEA19161+ TEA19162+ TEA1995) 

Low-Cost Production Proven Smart eLock Solution 

Fingerprint-on-card—A Vehicle for Innovation in the Card Industry 

 

Emerging Trends & Innovation

Secure Tamper-Resistant Authentication_Connects China 

An Overview of NXP MCU Portfolio Based on Arm® Cortex®-M Cores 

Attachments

    Outcomes