Logic Packaging

Document created by Diana Torres Employee on May 6, 2016Last modified by Diana Torres Employee on Apr 18, 2017
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Demo

This demo shows the wide variety of package solutions from NXP Logic from traditional large packages to the newest innovative GX “Diamond” package. Actual packages and suggested solder footprints are included for size comparison

 

 

Features:

  • Many packaging solutions to meet design requirements for footprint, height and lead pitch
  • GX package has industry’s smallest footprint yet easily-placed 0.4mm lead pitch

 

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Featured NXP Products:

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